Soldering, Desoldering, Rework Stations

Part Number	Description / PDF	Quantity
T0053380270N Xcelite	WR 2000ER SET DSX120/WP 65 120V	0
WSL Xcelite	SOLDERING STATION 95W 1 CH 120V	0
WXD2020N Xcelite	DESOLDER STATION 200W 2 CH 120V	5
WXR3001N Xcelite	SOLDER REWORK STA 600W 3 CH 120V	14
WT1011HN Xcelite	SOLDERING STATION 150W 1 CH 120V	0
WR2000N Xcelite	REWORK STATION 300W 2 CH 120V	4
T0052702999N Xcelite	PREHEATING PLATE 120W 1 CH 24V	0
T0051391199 Xcelite	SOLDERING STATION 120W 1 CH	2
WX1N Xcelite	SOLDERING STATION 200W 1 CH 120V	17
WR3MEN Xcelite	REWORK SOLDER STA 400W 3 CH 120V	2
WT1011N Xcelite	SOLDERING STATION 90W 1 CH 120V	17
WT1013NP Xcelite	WT1013 BUNDLE	17
WT2021MS Xcelite	SOLDER REWORK STA 150W 2 CH 120V	10
WT1013N Xcelite	SOLDERING STATION 90W 1 CH 120V	103
WAD101N Xcelite	REWORK STATION 100W 1 CH 120V	16
WHA3000PSN Xcelite	REWORK STATION 700W 1 CH 230V	0
WD1MN Xcelite	REWORK SOLDER STA 160W 1 CH 120V	109
T0051390699 Xcelite	SOLDERING STATION 80W 1 CH	4
WR2000XN Xcelite	DESOLDER STATION 300W 2 CH 120V	7
WTBR1000FTLCA Xcelite	WTBR 1000 CAMERA/LED 120V	0

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Soldering Stations	Temperature-controlled soldering irons, hot-air systems, and infrared heating	PCB assembly, fine-pitch component soldering
Desoldering Stations	Vacuum pumps for solder removal, temperature-sensitive desoldering tips	Component replacement, PCB repair
Rework Stations	Multi-functional platforms combining soldering/desoldering with precision control	BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter	Description
Temperature Range	100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery	Ability to maintain set temperature under thermal load (critical for SMT)
Power Output	50-200W depending on application requirements
Nozzle Compatibility	Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety	Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Metcal	SX800 Selectable Output Series	SmartHeat technology with 256 temperature profiles
JBC	CD 2B Plus Rework Station	Modular design with instant heating cartridges
Aoyue	968A+ Soldering Station	Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems