Soldering, Desoldering, Rework Stations

Image Part Number Description / PDF Quantity Rfq
WSLPU

WSLPU

Xcelite

SOLDERING STATION 95W 1 CH 120V

0

WD1002T

WD1002T

Xcelite

SOLDERING STATION 80W 1 CH 120V

0

T0053427699N

T0053427699N

Xcelite

SOLDERING STATION 200W 1 CH 230V

0

WD2000M

WD2000M

Xcelite

DESOLDER SLDR STA 160W 2 CH 120V

0

WD1000M

WD1000M

Xcelite

SOLDER STATION 85W 1 CH 100-230V

0

WD1003N

WD1003N

Xcelite

SOLDERING STATION 65W 1 CH 120V

0

WSF81D8

WSF81D8

Xcelite

SOLDERING STATION 90W 2 CH 120V

0

WD1000HPT

WD1000HPT

Xcelite

SOLDERING STATION 160W 1 CH 120V

0

WSM1CN

WSM1CN

Xcelite

SOLDER STATION 40W 1 CH 100-240V

0

WTCPT

WTCPT

Xcelite

SOLDERING STATION 60W 1 CH 120V

0

WSL2

WSL2

Xcelite

SOLDERING STATION 150W 2 CH 120V

0

WD1001

WD1001

Xcelite

SOLDERING STATION 65W 1 CH 120V

0

WRS3000S

WRS3000S

Xcelite

SOLDER REWORK STA 300W 3 CH 120V

0

WSD81

WSD81

Xcelite

SOLDERING STATION 80W 1 CH 230V

0

WD1002N

WD1002N

Xcelite

SOLDERING STATION 80W 1 CH 120V

0

WTCPTD

WTCPTD

Xcelite

SOLDERING STATION 60W 1 CH 240V

0

WHA900N

WHA900N

Xcelite

REWORK STATION 750W 1 CH 120V

0

WHA300

WHA300

Xcelite

REWORK STATION 700W 1 CH 120V

0

WESD51

WESD51

Xcelite

SOLDERING STATION 50W 1 CH 120V

0

T0053421699N

T0053421699N

Xcelite

SOLDERING STATION 200W 2 CH 230V

0

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Soldering Stations Temperature-controlled soldering irons, hot-air systems, and infrared heating PCB assembly, fine-pitch component soldering
Desoldering Stations Vacuum pumps for solder removal, temperature-sensitive desoldering tips Component replacement, PCB repair
Rework Stations Multi-functional platforms combining soldering/desoldering with precision control BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter Description
Temperature Range 100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery Ability to maintain set temperature under thermal load (critical for SMT)
Power Output 50-200W depending on application requirements
Nozzle Compatibility Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Metcal SX800 Selectable Output Series SmartHeat technology with 256 temperature profiles
JBC CD 2B Plus Rework Station Modular design with instant heating cartridges
Aoyue 968A+ Soldering Station Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems

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