Soldering, Desoldering, Rework Stations

Image Part Number Description / PDF Quantity Rfq
WT1010NP

WT1010NP

Xcelite

WT1010 BUNDLE

21

WHP3000N

WHP3000N

Xcelite

PREHEATING PLATE 600W 120V

5

T0053250699N

T0053250699N

Xcelite

SOLDERING STATION 80W 1 CH 230V

29

WDD81XN

WDD81XN

Xcelite

SOLDER REWORK STA 95W 1 CH 120V

5

T0053419699N

T0053419699N

Xcelite

SOLDERING STATION 200W 1 CH 230V

0

WHP1000N

WHP1000N

Xcelite

PREHEATING PLATE 1KW 120V

5

WT2M

WT2M

Xcelite

SOLDER REWORK STA 150W 2 CH 120V

5

WX2N

WX2N

Xcelite

SOLDERING STATION 200W 2 CH 120V

10

WXA2N

WXA2N

Xcelite

REWORK SOLDER STA 200W 2 CH 120V

0

WHA3000P

WHA3000P

Xcelite

REWORK STATION 700W 1 CH 230V

0

WTHA1N

WTHA1N

Xcelite

REWORK STATION 900W 1 CH 120V

27

WTHA1NP

WTHA1NP

Xcelite

WTHA1 BUNDLE

17

WXD2N

WXD2N

Xcelite

DESOLDER STATION 200W 2 CH 120V

3

WT1N

WT1N

Xcelite

SOLDERING STATION 90W 1 CH 120V

6

WT1012N

WT1012N

Xcelite

SOLDERING STATION 90W 1 CH 120V

34

WX2020N

WX2020N

Xcelite

SOLDERING STATION 200W 2 CH 120V

0

WXR3002N

WXR3002N

Xcelite

SOLDER REWORK STA 600W 3 CH 120V

13

WX2021N

WX2021N

Xcelite

SOLDERING STATION 200W 2 CH 120V

62

WT1010HN

WT1010HN

Xcelite

SOLDERING STATION 150W 1 CH 120V

6

WLC100

WLC100

Xcelite

SOLDERING STATION 40W 1 CH 120V

61

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Soldering Stations Temperature-controlled soldering irons, hot-air systems, and infrared heating PCB assembly, fine-pitch component soldering
Desoldering Stations Vacuum pumps for solder removal, temperature-sensitive desoldering tips Component replacement, PCB repair
Rework Stations Multi-functional platforms combining soldering/desoldering with precision control BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter Description
Temperature Range 100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery Ability to maintain set temperature under thermal load (critical for SMT)
Power Output 50-200W depending on application requirements
Nozzle Compatibility Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Metcal SX800 Selectable Output Series SmartHeat technology with 256 temperature profiles
JBC CD 2B Plus Rework Station Modular design with instant heating cartridges
Aoyue 968A+ Soldering Station Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems

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