Soldering, Desoldering, Rework Stations

Part Number	Description / PDF	Quantity
WXR3003N Xcelite	SOLDER REWORK STA 600W 3 CH 120V	6
WR2000VXN Xcelite	DESOLDER SLDR STA 300W 2 CH 120V	3
WT2010M Xcelite	SOLDER REWORK STA 150W 2 CH 120V	9
WT2021MSP Xcelite	WT2021MS BUNDLE	18
WXA2010N Xcelite	REWORK SOLDER STA 200W 2 CH 120V	2
WR3MN Xcelite	SOLDER REWORK STA 400W 3 CH 120V	1
WX1012N Xcelite	SOLDERING STATION 200W 1 CH 120V	18
WX1011N Xcelite	SOLDERING STATION 200W 1 CH 120V	54
T0052702899N Xcelite	PREHEATING PLATE 80W 24V	3
WE1010NA Xcelite	SOLDERING STATION 70W 1 CH 120V	466
WX1010N Xcelite	SOLDERING STATION 200W 1 CH 120V	12
WHP200N Xcelite	PREHEATING PLATE 200W 120V	8
WR2N Xcelite	SOLDER REWORK STA 300W 2 CH 120V	0
WXD2010N Xcelite	DESOLDER STATION 200W 2 CH 120V	3
WT1010N Xcelite	SOLDERING STATION 90W 1 CH 120V	43
T0051390799 Xcelite	SOLDERING STATION 120W 1 CH	2
WR3000MN Xcelite	SOLDER REWORK STA 400W 3 CH 120V	9
T0053420699N Xcelite	SOLDERING STATION 200W 2 CH 230V	0
WT1HN Xcelite	SOLDERING STATION 150W 1 CH 120V	3
WE1010EDU Xcelite	SOLDERING STATION 70W 1 CH 120V	260

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Soldering Stations	Temperature-controlled soldering irons, hot-air systems, and infrared heating	PCB assembly, fine-pitch component soldering
Desoldering Stations	Vacuum pumps for solder removal, temperature-sensitive desoldering tips	Component replacement, PCB repair
Rework Stations	Multi-functional platforms combining soldering/desoldering with precision control	BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter	Description
Temperature Range	100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery	Ability to maintain set temperature under thermal load (critical for SMT)
Power Output	50-200W depending on application requirements
Nozzle Compatibility	Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety	Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Metcal	SX800 Selectable Output Series	SmartHeat technology with 256 temperature profiles
JBC	CD 2B Plus Rework Station	Modular design with instant heating cartridges
Aoyue	968A+ Soldering Station	Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems