Soldering, Desoldering, Rework Stations

Image	Part Number	Description / PDF	Quantity	Rfq
	T0053355699N Xcelite	WHA3000PS SET 230V 53355699	0
	T0053377699N Xcelite	WR 2 CONTROL UNIT 230V F/G	0
	T0053426699N Xcelite	DESOLDER SLDR STA 200W 2 CH 230V	0
	WHA3000PN Xcelite	REWORK STATION 700W 1 CH 120V	0
	WR3000TAN Xcelite	REWORK STATION 3 CH 120V	0
	WR5000MN Xcelite	REWORK STATION 5 CH 120V	0
	WR3000TSN Xcelite	REWORK STATION 3 CH 120V	0
	T0053338699N Xcelite	WHP 3000 HEATING PLATE 230V 600W	0
	T0052922599N Xcelite	WXP 90 SOLDERING SET W. HOLDER W	0
	WXR3N Xcelite	SOLDER REWORK STA 600W 3 CH 120V	0
	WRS1002X Xcelite	DESOLDER STATION 175W 2 CH 120V	0
	TWSM1 Xcelite	SOLDERING STATION 40W 1 CH 120V	0
	WSD161 Xcelite	SOLDERING STATION 150W 2 CH 120V	0
	WHA3000V Xcelite	REWORK STATION 700W 1 CH 230V	0
	WSL2PU Xcelite	SOLDERING STATION 95W 2 CH 120V	0
	WSF81D5 Xcelite	SOLDERING STATION 90W 2 CH 120V	0
	WES51 Xcelite	SOLDERING STATION 50W 1 CH 120V	0
	MT1500 Xcelite	SOLDERING STATION 130W 1 CH 120V	0
	T0053418699N Xcelite	SOLDERING STATION 200W 1 CH 230V	0
	WD2 Xcelite	SOLDERING STATION 160W 2 CH 120V	0

Soldering, Desoldering, Rework Stations

1. Overview

Soldering, desoldering, and rework stations are essential tools in electronics manufacturing and repair. These systems enable precise joining (soldering), removal (desoldering), and modification (rework) of electronic components on printed circuit boards (PCBs). With miniaturization of electronic devices and increasing complexity of surface-mount technology (SMT), these stations ensure high-quality connections while minimizing thermal damage to sensitive components. Their importance spans industries from consumer electronics to aerospace, where reliability and precision are critical.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Soldering Stations	Temperature-controlled soldering irons, hot-air systems, and infrared heating	PCB assembly, fine-pitch component soldering
Desoldering Stations	Vacuum pumps for solder removal, temperature-sensitive desoldering tips	Component replacement, PCB repair
Rework Stations	Multi-functional platforms combining soldering/desoldering with precision control	BGA/QFN package rework, prototype modifications

3. Structure and Components

Typical systems consist of: - Control Unit: Digital interface for temperature, airflow, and timing adjustments - Heating Element: Ceramic or carbon heating systems with rapid thermal response - Handpiece: Ergonomic design with interchangeable tips (soldering iron, hot-air nozzle) - Vacuum System: For desoldering applications (in integrated stations) - Temperature Sensors: Closed-loop feedback for 1 C accuracy

4. Key Technical Specifications

Parameter	Description
Temperature Range	100-450 C (standard), extended ranges available for specialty applications
Thermal Recovery	Ability to maintain set temperature under thermal load (critical for SMT)
Power Output	50-200W depending on application requirements
Nozzle Compatibility	Interchangeable nozzles for different component sizes (0.3mm to 5mm)
ESD Safety	Electrostatic discharge protection for sensitive electronics

5. Application Fields

- Consumer Electronics: Smartphone assembly (e.g., Apple iPhone motherboard repair) - Automotive: Engine control unit (ECU) manufacturing and repair - Medical Devices: Pacemaker PCB assembly requiring Class III IPC standards - Aerospace: Avionics systems with MIL-STD-2000A compliance - Prototyping: R&D labs for rapid circuit modifications

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Features
Metcal	SX800 Selectable Output Series	SmartHeat technology with 256 temperature profiles
JBC	CD 2B Plus Rework Station	Modular design with instant heating cartridges
Aoyue	968A+ Soldering Station	Advanced PID control, ESD-safe construction

7. Selection Recommendations

Consider: - Application type (precision SMT vs. heavy-duty repair) - Temperature stability requirements ( 2 C for BGA rework) - Tool interchangeability (multi-function stations save space) - Safety certifications (CE, ISO 13485 for medical applications) - Software integration (data logging for quality control) - Budget vs. long-term ROI (higher initial cost often reduces rework rates)

8. Industry Trends

Emerging developments include: - AI-powered thermal profiling for adaptive soldering - Miniaturization of hot-air nozzles for 01005 component handling - IoT-enabled stations with cloud-based process monitoring - Increased adoption of lead-free soldering systems (RoHS compliance) - Integration with automated optical inspection (AOI) systems