Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPXV5004GP

MPXV5004GP

NXP Semiconductors

SENSOR GAUGE PRESS .57PSI MAX

0

MPXM2010DT1

MPXM2010DT1

NXP Semiconductors

SENS PRESSURE 1.45PSI MAX MPAK

0

MPXV2202GP

MPXV2202GP

NXP Semiconductors

SENSOR GAUGE PRESS 29PSI MAX

0

NTM88H065T1

NTM88H065T1

NXP Semiconductors

IC PRESSURE SENSOR 24HQFN

0

MPX5050GP

MPX5050GP

NXP Semiconductors

SENSOR GAUGE PRESS 7.25 PSI MAX

1263

MPVZ5004G7U

MPVZ5004G7U

NXP Semiconductors

PRESSURE SENSOR SS CAP 8-DIP

0

MPX12GP

MPX12GP

NXP Semiconductors

SENSOR GAUGE PRESS 1.45PSI MAX

237

MPL3115A2R1

MPL3115A2R1

NXP Semiconductors

IC ALTIMETER I2C VERSION 8LGA

0

MPX4250D

MPX4250D

NXP Semiconductors

SENSOR DIFF PRESS 36.3PSI MAX

171

MPL115A2T1

MPL115A2T1

NXP Semiconductors

IC BAROMETER I2C DGTL MINI 8-LGA

1308

MPXM2102AS

MPXM2102AS

NXP Semiconductors

SENS PRESSURE 14.5 PSI MAX MPAK

61

MPX2050D

MPX2050D

NXP Semiconductors

SENSOR TEMP

219

MPXH6300AC6T1

MPXH6300AC6T1

NXP Semiconductors

SENSOR PRESSURE 20-304KPA 1317A

61

MPXH6300AC6U

MPXH6300AC6U

NXP Semiconductors

SENSOR ABS PRESS 42PSI MAX

2316

MPXM2102AT1

MPXM2102AT1

NXP Semiconductors

SENS PRESSURE 14.5 PSI MAX MPAK

833

MPX2102AP

MPX2102AP

NXP Semiconductors

SENSOR ABS PRESS 14.5PSI MAX

353

MPXM2202GST1

MPXM2202GST1

NXP Semiconductors

SENS PRESSURE 29 PSI MAX MPAK

368

MPX5700GP1

MPX5700GP1

NXP Semiconductors

PRESSURE SENSOR GAUGE 6-SIP

0

MPX5100GP

MPX5100GP

NXP Semiconductors

SENSOR GAUGE PRESS 14.5 PSI MAX

0

MPXV7007DP

MPXV7007DP

NXP Semiconductors

PRESSURE SENSOR DUAL PORT 8-SOP

968

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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