Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPVZ5004G6U

MPVZ5004G6U

NXP Semiconductors

PRESSURE SENSOR SS CAP 8-SOP

27

MPX4115A

MPX4115A

NXP Semiconductors

SENSOR ABS PRESS 16.7 PSI MAX

903

MPX2100AP

MPX2100AP

NXP Semiconductors

SENSOR ABS PRESS 14.5PSI MAX

85

MPX53DP

MPX53DP

NXP Semiconductors

SENSOR DIFF PRESS 7.25PSI MAX

0

MPX53GP

MPX53GP

NXP Semiconductors

SENSOR GAUGE PRESSURE 7 PSI MAX

0

MPXV5100DP

MPXV5100DP

NXP Semiconductors

PRESSURE SENSOR GAUGE DUAL 8-SOP

0

MPXV7002GC6U

MPXV7002GC6U

NXP Semiconductors

SENSOR PRESSURE 8SOP AXIAL PORT

0

MPXA4250AC6U

MPXA4250AC6U

NXP Semiconductors

PRESSURE SENS 36.3PSI MAX 8-SOP

395

MPXA4115A6U

MPXA4115A6U

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

3595

MPXV7002GC6T1

MPXV7002GC6T1

NXP Semiconductors

SENSOR PRESSURE 8SOP AXIAL PORT

0

MPX2050GSX

MPX2050GSX

NXP Semiconductors

PRESSURE SENSOR, 10V, 0/50KPA

600

MPXV2050GP

MPXV2050GP

NXP Semiconductors

SENSOR INTEG SILICON PRESSURE

121

MPXH6300A6U

MPXH6300A6U

NXP Semiconductors

SENSOR ABS PRESS 42PSI MAX

511

MPX2100D

MPX2100D

NXP Semiconductors

SENSOR DIFF PRESS 14.5PSI MAX

225

MPX2200GP

MPX2200GP

NXP Semiconductors

SENSOR GAUGE PRESS 29 PSI MAX

0

MPXA6115AC7U

MPXA6115AC7U

NXP Semiconductors

PRESSURE SENSOR ABS AXIAL 8-DIP

19

MP3H6115AC6T1

MP3H6115AC6T1

NXP Semiconductors

SENSOR PRESS 16.7PSI MAX 8-SSOP

346

MPXM2010GS

MPXM2010GS

NXP Semiconductors

SENS PRESSURE 1.45 PSI MAX MPAK

20

MPXA4100A6T1

MPXA4100A6T1

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

0

MPXA6115A6T1

MPXA6115A6T1

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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