Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPXV5004GC6U

MPXV5004GC6U

NXP Semiconductors

SENSOR GAUGE PRESS 0.57 PSI MAX

0

MPXV7007GP

MPXV7007GP

NXP Semiconductors

PRESSURE SENSOR SIDE PORT 8-SOP

240

MPL115A2

MPL115A2

NXP Semiconductors

IC BAROMETER I2C DGTL MINI 8LGA

4612

MPX5999D

MPX5999D

NXP Semiconductors

SENSOR DIFF PRESS 150 PSI MAX

551

MPVZ4006GW7U

MPVZ4006GW7U

NXP Semiconductors

PRESSURE SENSOR VERT 8-DIP

0

MPXM12GS

MPXM12GS

NXP Semiconductors

IC PRESSURE SENSOR 5-MPAK

0

MPX4080D

MPX4080D

NXP Semiconductors

SENSOR DIFF PRESS 11.6PSI MAX

0

MPXM2051GST1

MPXM2051GST1

NXP Semiconductors

SENSOR PRESSURE ABS AXIAL 5-MPAK

0

MPXV5010GC7U

MPXV5010GC7U

NXP Semiconductors

SENSOR INTEG SILICON PRESSURE

40

MPXM2202AS

MPXM2202AS

NXP Semiconductors

SENS PRESSURE 29 PSI MAX MPAK

2108

MPXV7002GP

MPXV7002GP

NXP Semiconductors

SENSOR PRESSURE 8SMD SIDED PORT

1547

MPXV2102GP

MPXV2102GP

NXP Semiconductors

SENSOR GAUGE PRESS 14.5PSI MAX

651

MPX2100DP

MPX2100DP

NXP Semiconductors

SENSOR DIFF PRESSURE 14.5 PSI MA

220

MPXM2102A

MPXM2102A

NXP Semiconductors

SENS PRESSURE 14.5 PSI MAX MPAK

526

MPXV2010GP

MPXV2010GP

NXP Semiconductors

SENSOR GAUGE PRESS 1.45PSI MAX

0

MPXV5004DP

MPXV5004DP

NXP Semiconductors

SENSOR PRESSURE SMD 8-SOP

0

MPXA4115AP

MPXA4115AP

NXP Semiconductors

SENSOR ABS PRESS 16.7PSI MAX

0

MP3V5050VC6U

MP3V5050VC6U

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPXM2053D

MPXM2053D

NXP Semiconductors

SENS PRESSURE 7.25 PSI MAX MPAK

0

MP3V5004GC6T1

MP3V5004GC6T1

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

RFQ BOM Call Skype Email
Top