Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPX5700GP

MPX5700GP

NXP Semiconductors

SENSOR GAUGE PRESS 101.5 PSI MAX

0

NTM88H055T1

NTM88H055T1

NXP Semiconductors

IC PRESSURE SENSOR 24HQFN

0

MPXA6115AC6U

MPXA6115AC6U

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

1780

MPVZ5004GC6U

MPVZ5004GC6U

NXP Semiconductors

SENSOR PRESSURE SS CAP SO8 SMD

0

MPVZ4006GW6U

MPVZ4006GW6U

NXP Semiconductors

PRESSURE SENSOR VERT 8-SOP

0

MPXM2010D

MPXM2010D

NXP Semiconductors

SENS PRESSURE 1.45PSI MAX MPAK

550

MPXH6115A6U

MPXH6115A6U

NXP Semiconductors

PEIZORESISTIVE SENSOR, ABSOLUTE,

1081

MPVZ5010GW7U

MPVZ5010GW7U

NXP Semiconductors

PRESSURE SENSOR VERT 8-DIP

456

MPX5010DP

MPX5010DP

NXP Semiconductors

SENSOR DIFF PRESS 1.45 PSI MAX

0

MP3V5010DP

MP3V5010DP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX5700AS

MPX5700AS

NXP Semiconductors

PRESSURE SENSOR ABS AXIAL 6-SIP

0

MPXV4006GC6T1

MPXV4006GC6T1

NXP Semiconductors

SENSOR PRESSURE BASIC SMD 8-SOP

0

MPXHZ6115A6T1

MPXHZ6115A6T1

NXP Semiconductors

SENSOR PRESSURE ABSOLUTE 8-SSOP

4

MPXV7002DP

MPXV7002DP

NXP Semiconductors

PRESSURE SENSOR DUAL PORT 8-SOP

0

MPXHZ6115AC6T1

MPXHZ6115AC6T1

NXP Semiconductors

SENSOR ABS PRESS 16.7PSI MAX

0

MP3V5050GP

MP3V5050GP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPXH6250AC6U

MPXH6250AC6U

NXP Semiconductors

SENSOR ABS PRESS 36PSI MAX

0

MPXV6115V6U

MPXV6115V6U

NXP Semiconductors

PRESSURE SENSOR

0

MPXC12DT1

MPXC12DT1

NXP Semiconductors

SENSOR PRESSURE 10KPA CHIP PAK

0

FXPS7550DS4T1

FXPS7550DS4T1

NXP Semiconductors

50-550 KPA BAP DIG SPI

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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