Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPXAZ6115A6U

MPXAZ6115A6U

NXP Semiconductors

SENSOR ABS PRESS 16.7PSI MAX

0

MPXM2102GST1

MPXM2102GST1

NXP Semiconductors

SENS PRESSURE 14.5 PSI MAX MPAK

0

MPX4100A

MPX4100A

NXP Semiconductors

SENSOR ABS PRESS 15.2 PSI MAX

0

MPXV4006G7U

MPXV4006G7U

NXP Semiconductors

SENSOR GAUGE PRESS .87PSI MAX

0

MPL015A1

MPL015A1

NXP Semiconductors

IC BAROMETER SPI DGTL MINI 8-LGA

0

MPX2100ASX

MPX2100ASX

NXP Semiconductors

PRESSURE SENSOR GAUGE 4-SIP

0

MPXV5525DP

MPXV5525DP

NXP Semiconductors

PRESSURE SENSOR DUAL PORT 8-SOP

0

MPX4250GP

MPX4250GP

NXP Semiconductors

IC SENSOR PRESSURE GAUGE 6-PIN

0

MPX2102GVP

MPX2102GVP

NXP Semiconductors

SENSOR GAUGE PRESS 14.5PSI MAX

0

MPXV6115VC6T1

MPXV6115VC6T1

NXP Semiconductors

PRESSURE SENSOR AXIAL PORT 8-SOP

0

MPXV7007DPT1

MPXV7007DPT1

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX4115AS

MPX4115AS

NXP Semiconductors

PRESSURE SENSOR ABSOLUTE 6-SIP

0

MPX4105A

MPX4105A

NXP Semiconductors

SENSOR ABS PRESS 15.2PSI MAX

0

MPX2102D

MPX2102D

NXP Semiconductors

SENSOR DIFF PRESS 14.5PSI MAX

0

MPXV7007GC6T1

MPXV7007GC6T1

NXP Semiconductors

PRESSURE SENSOR AXIAL PORT 8-SOP

0

MPXV2102DP

MPXV2102DP

NXP Semiconductors

SENSOR PRESSURE GAUGE DUAL 8-SOP

0

MPX5700A

MPX5700A

NXP Semiconductors

SENSOR ABS PRESS 101.5PSI MAX

0

MPX2202D

MPX2202D

NXP Semiconductors

SENSOR DIFF PRESS 29PSI MAX

0

MPXV53GC7U

MPXV53GC7U

NXP Semiconductors

PRESSURE SENSOR 7PSI 8DIP

0

MPXV12DP

MPXV12DP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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