Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPX2050DP,117

MPX2050DP,117

NXP Semiconductors

PRESSURE SENSOR, 10V, 0/50KPA, S

0

FXPS7165DI4T1

FXPS7165DI4T1

NXP Semiconductors

60-165 KPA BAP DIG I2C

0

FXPS7115DI4T1

FXPS7115DI4T1

NXP Semiconductors

40-115 KPA BAP DIG I2C

0

FXPS7250A4T1

FXPS7250A4T1

NXP Semiconductors

20-250 KPA ANALOG

0

FXPS7140P4T1

FXPS7140P4T1

NXP Semiconductors

PRESSURE SATELLITE, 40-140 KPA,

0

FXPS7400DS4T1

FXPS7400DS4T1

NXP Semiconductors

20-400 KPA BAP DIG SPI

0

FXPS7115DS4T1

FXPS7115DS4T1

NXP Semiconductors

40-115 KPA BAP DIG SPI

0

MPX2102DP117

MPX2102DP117

NXP Semiconductors

PEIZORESISTIVE SENSOR, DIFFERENT

0

FXPS7550DI4T1

FXPS7550DI4T1

NXP Semiconductors

50-550 KPA BAP DIG I2C

0

FXPS71404T1

FXPS71404T1

NXP Semiconductors

PRESSURE SATELLITE, 40-140 KPA,

0

FXPS7165DS4T1

FXPS7165DS4T1

NXP Semiconductors

60-165 KPA BAP DIG SPI

0

MPX4400A

MPX4400A

NXP Semiconductors

SENSOR ABS PRESS 56.6 PSI MAX

0

FXPS7400DI4T1

FXPS7400DI4T1

NXP Semiconductors

20-400 KPA BAP DIG I2C

0

MPX4400AP

MPX4400AP

NXP Semiconductors

SENSOR ABS PRESS 56.6 PSI MAX

0

FXPS7550A4T1

FXPS7550A4T1

NXP Semiconductors

50-550 KPA ANALOG

0

FXPS7140D4T1

FXPS7140D4T1

NXP Semiconductors

PRESSURE SATELLITE, 40-140 KPA,

0

FXPS7250DI4T1

FXPS7250DI4T1

NXP Semiconductors

20-250 KPA BAP DIG I2C

0

FXPS7250DS4T1

FXPS7250DS4T1

NXP Semiconductors

20-250 KPA BAP DIG SPI

0

MPXHZ6400AC6T1,128

MPXHZ6400AC6T1,128

NXP Semiconductors

20 TO 400 KPA, ABSOLUTE, INTEGRA

0

FXPS7400A4T1

FXPS7400A4T1

NXP Semiconductors

20-400 KPA ANALOG

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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