Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPX5010GSX

MPX5010GSX

NXP Semiconductors

IC PRESSURE SENSOR 6-PIN

0

MPXHZ6130AC6U

MPXHZ6130AC6U

NXP Semiconductors

SENSOR PRESSURE AXIAL PORT 8SSOP

1649

MPXM2010GST1

MPXM2010GST1

NXP Semiconductors

SENS PRESSURE 1.45 PSI MAX 5MPAK

0

NTM88H075T1

NTM88H075T1

NXP Semiconductors

IC PRESSURE SENSOR 24HQFN

0

MPXHZ6400AC6T1

MPXHZ6400AC6T1

NXP Semiconductors

SENSOR PRESSURE ABS AXIAL 8-SSOP

577

MPX5010GS

MPX5010GS

NXP Semiconductors

SENSOR PRESSURE GAUGE 6SIP AXIAL

0

MPXV5004GPT1

MPXV5004GPT1

NXP Semiconductors

SENSOR PRESSURE SMD 8-SOP

0

MPXV7007GC6U

MPXV7007GC6U

NXP Semiconductors

PRESSURE SENSOR AXIAL PORT 8-SOP

16182

MPX5700AP

MPX5700AP

NXP Semiconductors

IC PRESSURE SENSOR ABS 6-SIP

1159

MPX2050DP

MPX2050DP

NXP Semiconductors

IC PRESSURE SENSOR 4-PIN

3308

MPXH6250A6U

MPXH6250A6U

NXP Semiconductors

SENSOR ABS PRESS 36PSI MAX

2601

MPXH6101A6T1

MPXH6101A6T1

NXP Semiconductors

SENSOR ABS PRESS 14.8PSI MAX

8

MP3V5004GP

MP3V5004GP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX2202DP

MPX2202DP

NXP Semiconductors

SENSOR DIFF PRESS 29PSI MAX

535

MPX2050GP

MPX2050GP

NXP Semiconductors

SENSOR PRESSURE 7.25PSI MAX

1144

MPXV5010DP

MPXV5010DP

NXP Semiconductors

SENSOR PRESSURE INTEGRATED SILIC

0

MPXH6115AC6T1

MPXH6115AC6T1

NXP Semiconductors

SENS ABS PRESS 16.7PSI MAX 8SSOP

0

MPX4250AP

MPX4250AP

NXP Semiconductors

SENSOR ABS PRESS 36.3 PSI MAX

0

MPX2200AP

MPX2200AP

NXP Semiconductors

SENSOR ABS PRESS 29PSI MAX

0

MP3V5050DP

MP3V5050DP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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