Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPXV2202DPT1

MPXV2202DPT1

NXP Semiconductors

SENSOR PRESSURE DIFF DUAL 8SOP

152

MPX5010GP

MPX5010GP

NXP Semiconductors

SENSOR GAUGE PRESS 1.45 PSI MAX

1498

MP3V5010GC6U

MP3V5010GC6U

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX5700DP

MPX5700DP

NXP Semiconductors

SENSOR DIFF PRESS 101.5 PSI MAX

438

MPXV2053DP

MPXV2053DP

NXP Semiconductors

SENSOR PRESSURE DIFF DUAL 8-SOP

0

MPX2102ASX

MPX2102ASX

NXP Semiconductors

SENSOR ABS PRESS 14.5PSI MAX

0

MP3V5004DP

MP3V5004DP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX2010GSX

MPX2010GSX

NXP Semiconductors

PRESSURE SENSOR GAUGE AXL 4SIP

287

MPXV5100GC7U

MPXV5100GC7U

NXP Semiconductors

PRESSURE SENSOR SILICON 8-DIP

303

MPX2053D

MPX2053D

NXP Semiconductors

PRESSURE SENSOR DIFF 4-SIP

0

MPX5700ASX

MPX5700ASX

NXP Semiconductors

PRESSURE SENSOR ABS AXIAL 6-SIP

5

MPXV4115VC6U

MPXV4115VC6U

NXP Semiconductors

SENSOR VAC PRESS -16.68PSI MAX

176

MPXH6400AC6U

MPXH6400AC6U

NXP Semiconductors

PRESSURE SENSOR ABS AXIAL 8-SSOP

3714

MPXAZ6115AP

MPXAZ6115AP

NXP Semiconductors

PRESSURE SENSOR ABSOLUTE 8-SOP

0

MPX5100AP

MPX5100AP

NXP Semiconductors

SENSOR ABS PRESS 16.68 PSI MAX

508

MPXA6115AC6T1

MPXA6115AC6T1

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

0

MPX4250DP

MPX4250DP

NXP Semiconductors

SENSOR DIFF PRESS 36 PSI MAX

843

MPXHZ6250AC6T1

MPXHZ6250AC6T1

NXP Semiconductors

SENSOR PRESSURE ABS AXIAL 8-SSOP

1706

MPXV5050VC6T1

MPXV5050VC6T1

NXP Semiconductors

SENSOR DIFF PRESS -7.25-0PSI MAX

2228

MPX2300DT1

MPX2300DT1

NXP Semiconductors

PRESSURE SENSE MED 4SIP CHIP PAK

12195

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

RFQ BOM Call Skype Email
Top