Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPL3115A2

MPL3115A2

NXP Semiconductors

IC ALTIMETER I2C VERSION 8LGA

0

MPX5050GP1

MPX5050GP1

NXP Semiconductors

PRESSURE SENSOR GAUGE 6-SIP

216

MPVZ5010GW6U

MPVZ5010GW6U

NXP Semiconductors

PRESSURE SENSOR VERT 8-SOP

149

MPX2010GP

MPX2010GP

NXP Semiconductors

SENSOR GAUGE PRESS 1.45 PSI MAX

684

MPXH6300A6T1

MPXH6300A6T1

NXP Semiconductors

SENSOR PRESSURE ABSOLUTE 8-SSOP

0

MPXHZ6250A6T1

MPXHZ6250A6T1

NXP Semiconductors

SENSOR PRESSURE ELEMENT 8SSOP

0

MPXV4006DP

MPXV4006DP

NXP Semiconductors

SENSOR PRESSURE DUAL SMD 8-SOP

0

MPX2202GP

MPX2202GP

NXP Semiconductors

SENSOR GAUGE PRESS 29PSI MAX

0

MP3H6115A6U

MP3H6115A6U

NXP Semiconductors

IC PRESSURE SENSOR 16.7PSI 8SSOP

58

MPXV5050GC6T1

MPXV5050GC6T1

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

590

MP3V5010GC6T1

MP3V5010GC6T1

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX53D

MPX53D

NXP Semiconductors

SENSOR DIFF PRESS 7.25PSI MAX

0

MPXM2102AST1

MPXM2102AST1

NXP Semiconductors

SENS PRESSURE 14.5 PSI MAX MPAK

0

MPX2200D

MPX2200D

NXP Semiconductors

SENSOR DIFF PRESSURE 29 PSI MAX

98

MPXM2102GS

MPXM2102GS

NXP Semiconductors

SENS PRESSURE 14.5 PSI MAX MPAK

0

MPVZ5004GW7U

MPVZ5004GW7U

NXP Semiconductors

PRESSURE SENSOR VERT 8-DIP

0

MPX12D

MPX12D

NXP Semiconductors

PEIZORESISTIVE SENSOR, DIFFERENT

96

MPXV5100GC6U

MPXV5100GC6U

NXP Semiconductors

SENSOR GAUGE PRESS 14.5PSI MAX

1000

MPXM2202GS

MPXM2202GS

NXP Semiconductors

SENS PRESSURE 29 PSI MAX MPAK

0

MPXH6115AC6U

MPXH6115AC6U

NXP Semiconductors

SENSOR ABS PRESS 16.7PSI MAX

883

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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