Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPX2010DP

MPX2010DP

NXP Semiconductors

SENSOR PRESSURE 1.45PSI MAX

700

MPXM2053GST1

MPXM2053GST1

NXP Semiconductors

SENS PRESSURE 7.25 PSI MAX MPAK

0

MPL115A1

MPL115A1

NXP Semiconductors

IC BAROMETER SPI DGTL MINI 8LGA

0

MPXV2010DP

MPXV2010DP

NXP Semiconductors

SENSOR INTEG SILICON PRESSURE

0

MPX10DP

MPX10DP

NXP Semiconductors

SENSOR DIFF PRESS 1.45 PSI MAX

622

MPXHZ6130A6U

MPXHZ6130A6U

NXP Semiconductors

PRESSURE SENSOR ELEMENT 8SSOP

445

MPXV5050GP

MPXV5050GP

NXP Semiconductors

SENSOR GAUGE PRESS 7.25PSI MAX

702

MPXV5010GP

MPXV5010GP

NXP Semiconductors

SENSOR GAUGE PRESS 1.45PSI MAX

1041

MPXV5010G6U

MPXV5010G6U

NXP Semiconductors

SENSOR PRESSURE GAUGE SMD 8-SOP

160

MPXA4115AC6U

MPXA4115AC6U

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

0

MPXV5100GP

MPXV5100GP

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX2010D

MPX2010D

NXP Semiconductors

SENSOR DIFF PRESS 1.45 PSI MAX

4423

MPXV2202DP

MPXV2202DP

NXP Semiconductors

SENSOR PRESSURE DIFF DUAL 8-SOP

585

MPX10D

MPX10D

NXP Semiconductors

PEIZORESISTIVE SENSOR, DIFFERENT

80

MPX5700D

MPX5700D

NXP Semiconductors

SENSOR DIFF PRESS 101.5PSI MAX

4559

MPX4100AP

MPX4100AP

NXP Semiconductors

SENSOR ABS PRESS 15.2 PSI MAX

203

MPVZ5010G6U

MPVZ5010G6U

NXP Semiconductors

PEIZORESISTIVE SENSOR, GAGE, 0PS

0

FXPQ3115BVT1

FXPQ3115BVT1

NXP Semiconductors

PRESSURE SENSOR 2.5V 20/110KPA

2157

MP3V5004GC6U

MP3V5004GC6U

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPXH6400AC6T1

MPXH6400AC6T1

NXP Semiconductors

SENSOR ABS PRESS 58PSI MAX

1701

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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