Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPX2100A

MPX2100A

NXP Semiconductors

SENSOR ABS PRESS 14.5PSI MAX

10

MPXV7002DPT1

MPXV7002DPT1

NXP Semiconductors

PRESSURE SENSOR DUAL PORT 8SOP

0

MPXV5050GC6U

MPXV5050GC6U

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

2

MPXHZ6115AC6U

MPXHZ6115AC6U

NXP Semiconductors

SENSOR ABS PRESS 16.7PSI MAX

0

MPXV5050DP

MPXV5050DP

NXP Semiconductors

SENSOR PRESSURE DUAL PORT 8-SOP

0

MPXV5010GC6T1

MPXV5010GC6T1

NXP Semiconductors

SENSOR PRESSURE GAUGE SMD 8SOP

1300

MPXHZ6250A6U

MPXHZ6250A6U

NXP Semiconductors

SENSOR PRESSURE ELEMENT 8SSOP

256

MP3V5050GC6U

MP3V5050GC6U

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX2200A

MPX2200A

NXP Semiconductors

SENSOR ABS PRESS 29PSI MAX

125

MPXM2053GS

MPXM2053GS

NXP Semiconductors

SENS PRESSURE 7.25 PSI MAX MPAK

0

MPXH6115A6T1

MPXH6115A6T1

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8SSOP

797

MPXV4006GC7U

MPXV4006GC7U

NXP Semiconductors

SENSOR GAUGE PRESS .87PSI MAX

0

MPX5050D

MPX5050D

NXP Semiconductors

SENSOR DIFF PRESS 7.25 PSI MAX

168

MPXAZ6115AC6T1

MPXAZ6115AC6T1

NXP Semiconductors

SENSOR PRESSURE ABS AXIAL 8-SOP

0

MPX5500DP

MPX5500DP

NXP Semiconductors

IC SENSOR PRESS GAUGE 75PSI RANG

0

MPXM12GST1

MPXM12GST1

NXP Semiconductors

IC PRESSURE SENSOR 5-MPAK

0

MPXM2053DT1

MPXM2053DT1

NXP Semiconductors

SENS PRESSURE 7.25 PSI MAX MPAK

0

MPX2200DP

MPX2200DP

NXP Semiconductors

SENSOR DIFF PRESS 29PSI MAX

9

MPX5100DP

MPX5100DP

NXP Semiconductors

IC SENSOR PRESS 14.5 PSI MAX

0

MPX2202AP

MPX2202AP

NXP Semiconductors

PRESSURE SENSOR 0-200KPA TEM COM

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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