Pressure Sensors, Transducers

Image Part Number Description / PDF Quantity Rfq
MPXM2202DT1

MPXM2202DT1

NXP Semiconductors

SENS PRESSURE 29 PSI MAX MPAK

0

MPXV7025DP

MPXV7025DP

NXP Semiconductors

PRESSURE SENSOR DUAL PORT 8-SOP

0

MPXV7025GC6U

MPXV7025GC6U

NXP Semiconductors

PRESSURE SENSOR AXIAL PORT 8-SOP

11788

MPXV2202GC6U

MPXV2202GC6U

NXP Semiconductors

PRESSURE SENSOR AXIAL 8-SOP

0

MPXA6115A6U

MPXA6115A6U

NXP Semiconductors

PRESSURE SENS 16.7PSI MAX 8-SOP

279

MPX10GP

MPX10GP

NXP Semiconductors

SENSOR GAUGE PRESS 1.45PSI MAX

1362

MPL115A1T1

MPL115A1T1

NXP Semiconductors

IC BAROMETER SPI DGTL MINI 8-LGA

1483

MPXM2202A

MPXM2202A

NXP Semiconductors

SENS PRESSURE 29 PSI MAX MPAK

456

MPXV4006GC6U

MPXV4006GC6U

NXP Semiconductors

PEIZORESISTIVE SENSOR, GAGE, 0PS

0

MPX4115AP

MPX4115AP

NXP Semiconductors

SENSOR ABS PRESS 16.7 PSI MAX

0

MPXA4250A6U

MPXA4250A6U

NXP Semiconductors

PRESSURE SENS 36.3PSI MAX 8-SOP

1

MPXV5010GC6U

MPXV5010GC6U

NXP Semiconductors

SENSOR INTEG SILICON PRESSURE

0

MPXM2051GS

MPXM2051GS

NXP Semiconductors

PRESSURE SENSOR ABS AXIAL 5-MPAK

0

MP3V5050GC6T1

MP3V5050GC6T1

NXP Semiconductors

IC PRESSURE SENSOR 8-SOP

0

MPX2102DP

MPX2102DP

NXP Semiconductors

SENSOR DIFF PRESS 14.5PSI MAX

547

MPXV6115VC6U

MPXV6115VC6U

NXP Semiconductors

SENSOR PRESSURE VACUUM -16.68PSI

301

MPXV5004GC6T1

MPXV5004GC6T1

NXP Semiconductors

SENSOR GAUGE PRESS .57PSI MAX

1242

MPXV10GC6U

MPXV10GC6U

NXP Semiconductors

SENSOR PRESSURE PORTED 8-SOP

0

MPX5050DP

MPX5050DP

NXP Semiconductors

SENSOR DIFF PRESS 7.25 PSI MAX

0

MPX4250A

MPX4250A

NXP Semiconductors

SENSOR ABS PRESS 36.3PSI MAX

0

Pressure Sensors, Transducers

1. Overview

Pressure sensors and transducers are devices that convert mechanical pressure signals into electrical outputs. They serve as critical components in monitoring and controlling pressure in various systems. Modern industrial automation, medical diagnostics, and automotive safety systems rely on their precise measurements to ensure operational efficiency and safety.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Strain GaugeHigh accuracy, stable output, requires bridge circuitIndustrial machinery, load cells
PiezoresistiveMiniaturized design, high sensitivity, temperature-dependentMedical blood pressure monitors
CapacitiveLow power consumption, corrosion-resistant, nonlinear outputAerospace altitude sensors
PiezoelectricSelf-generating, dynamic pressure measurementEngine combustion analysis
Optical FiberImmune to EMI, suitable for harsh environmentsOil well downhole monitoring

3. Structure and Components

Typical components include:

  • Pressure port (stainless steel/ceramic diaphragm)
  • Sensing element (MEMS silicon chip, strain gauge)
  • Signal conditioning circuit (amplifier, ADC)
  • Output interface (4-20mA, I2C, CANbus)
  • Environmental sealing (IP67 rating standard)

4. Key Technical Specifications

ParameterImportance
Measurement Range (0-10kPa to 0-100MPa)Determines operational limits
Accuracy ( 0.1% FS to 2% FS)Impacts system reliability
Output Signal (Analog/digital)Affects compatibility with control systems
Temperature Range (-40 C to +150 C)Defines environmental adaptability
Response Time (1ms to 100ms)Critical for dynamic pressure monitoring

5. Application Fields

Major industries:

  • Industrial Automation (hydraulic system monitoring)
  • Automotive (engine MAP sensors, TPMS)
  • Medical (ventilator pressure control)
  • Aerospace (flight control surface pressure)
  • Consumer Electronics (smartwatches for altitude tracking)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
HoneywellPPT0010 (0-10psi MEMS sensor)
Bosch SensortecBMP580 (barometric pressure sensor)
TE ConnectivityPPT0001NN1A3 (high-temperature sensor)
WIKAA-1100.75 (industrial process sensor)
OmronD6F-PH (low-pressure airflow sensor)

7. Selection Guidelines

Key considerations:

  • Pressure range with 20% safety margin
  • Environmental factors (temperature, vibration)
  • Signal compatibility (analog/digital requirements)
  • Material selection for corrosive environments
  • Cost vs. long-term stability trade-offs

8. Industry Trends

Emerging developments:

  • MEMS integration for miniaturization
  • Wireless pressure sensing nodes
  • AI-enabled predictive maintenance systems
  • New materials like graphene for ultra-sensitive detection
  • Energy-harvesting self-powered sensors

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