Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV303JV Panasonic	RES ARRAY 8 RES 30K OHM 1506	0
EXB-34V754JV Panasonic	RES ARRAY 2 RES 750K OHM 0606	0
EXB-28V274JX Panasonic	RES ARRAY 4 RES 270K OHM 0804	0
EXB-N8V223JX Panasonic	RES ARRAY 4 RES 22K OHM 0804	14710
EXB-V4V513JV Panasonic	RES ARRAY 2 RES 51K OHM 0606	0
EXB-V4V333JV Panasonic	RES ARRAY 2 RES 33K OHM 0606	2045
EXB-24V820JX Panasonic	RES ARRAY 2 RES 82 OHM 0404	19681
EXB-2HV183JV Panasonic	RES ARRAY 8 RES 18K OHM 1506	2365
EXB-V8V124JV Panasonic	RES ARRAY 4 RES 120K OHM 1206	37655
EXB-V8V134JV Panasonic	RES ARRAY 4 RES 130K OHM 1206	0
EXB-V8V133JV Panasonic	RES ARRAY 4 RES 13K OHM 1206	0
EXB-V8V162JV Panasonic	RES ARRAY 4 RES 1.6K OHM 1206	0
EXB-D10C820J Panasonic	RES ARRAY 8 RES 82 OHM 1206	5000
EXB-14V101JX Panasonic	RES ARRAY 2 RES 100 OHM 0302	6558
EXB-28V204JX Panasonic	RES ARRAY 4 RES 200K OHM 0804	990
EXB-24V510JX Panasonic	RES ARRAY 2 RES 51 OHM 0404	0
EXB-34V134JV Panasonic	RES ARRAY 2 RES 130K OHM 0606	0
EXB-V8V181JV Panasonic	RES ARRAY 4 RES 180 OHM 1206	11895
EXB-E10C680J Panasonic	RES ARRAY 8 RES 68 OHM 1608	0
EXB-28V622JX Panasonic	RES ARRAY 4 RES 6.2K OHM 0804	18877

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages