Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV162JV Panasonic	RES ARRAY 8 RES 1.6K OHM 1506	0
EXB-N8V682JX Panasonic	RES ARRAY 4 RES 6.8K OHM 0804	39480
EXB-18V271JX Panasonic	RES ARRAY 4 RES 270 OHM 0502	2032
EXB-24V564JX Panasonic	RES ARRAY 2 RES 560K OHM 0404	0
EXB-V8V913JV Panasonic	RES ARRAY 4 RES 91K OHM 1206	0
EXB-2HV203JV Panasonic	RES ARRAY 8 RES 20K OHM 1506	0
EXB-14V180JX Panasonic	RES ARRAY 2 RES 18 OHM 0302	9390
EXB-V8V161JV Panasonic	RES ARRAY 4 RES 160 OHM 1206	0
EXB-28V151JX Panasonic	RES ARRAY 4 RES 150 OHM 0804	537
EXB-V4V152JV Panasonic	RES ARRAY 2 RES 1.5K OHM 0606	14680
EXB-D10C824J Panasonic	RES ARRAY 8 RES 820K OHM 1206	0
EXB-V8V682JV Panasonic	RES ARRAY 4 RES 6.8K OHM 1206	28409
EXB-28V620JX Panasonic	RES ARRAY 4 RES 62 OHM 0804	1076
EXB-34V680JV Panasonic	RES ARRAY 2 RES 68 OHM 0606	45000
EXB-F6V334G Panasonic	RES ARRAY 3 RES 330K OHM 6SIP	1547
EXB-2HV240JV Panasonic	RES ARRAY 8 RES 24 OHM 1506	5000
EXB-A10P101J Panasonic	RES ARRAY 8 RES 100 OHM 2512	12346
EXB-38V753JV Panasonic	RES ARRAY 4 RES 75K OHM 1206	0
EXB-24V913JX Panasonic	RES ARRAY 2 RES 91K OHM 0404	0
EXB-38V164JV Panasonic	RES ARRAY 4 RES 160K OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages