Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V8V681JV Panasonic	RES ARRAY 4 RES 680 OHM 1206	27670
EXB-E10C222J Panasonic	RES ARRAY 8 RES 2.2K OHM 1608	4364
EXB-V8V750JV Panasonic	RES ARRAY 4 RES 75 OHM 1206	0
EXB-D10C470J Panasonic	RES ARRAY 8 RES 47 OHM 1206	5525
EXB-38V105JV Panasonic	RES ARRAY 4 RES 1M OHM 1206	338725
EXB-V4V563JV Panasonic	RES ARRAY 2 RES 56K OHM 0606	12988
EXB-A10P104J Panasonic	RES ARRAY 8 RES 100K OHM 2512	8052
EXB-24V154JX Panasonic	RES ARRAY 2 RES 150K OHM 0404	19830
EXB-U28470JX Panasonic	RES ARRAY 4 RES 47 OHM 0804	13549
EXB-N8V624JX Panasonic	RES ARRAY 4 RES 620K OHM 0804	0
EXB-2HV562JV Panasonic	RES ARRAY 8 RES 5.6K OHM 1506	12620
EXB-V8V120JV Panasonic	RES ARRAY 4 RES 12 OHM 1206	1940
EXB-N8V820JX Panasonic	RES ARRAY 4 RES 82 OHM 0804	8196
EXB-28N150JX Panasonic	RES ARRAY 4 RES 15 OHM 0804	19488
EXB-38V331JV Panasonic	RES ARRAY 4 RES 330 OHM 1206	27955
EXB-Q16P224J Panasonic	RES ARRAY 15 RES 220K OHM 1506	5362
EXB-38V620JV Panasonic	RES ARRAY 4 RES 62 OHM 1206	0
EXB-38V623JV Panasonic	RES ARRAY 4 RES 62K OHM 1206	0
EXB-24V360JX Panasonic	RES ARRAY 2 RES 36 OHM 0404	0
EXB-34V823JV Panasonic	RES ARRAY 2 RES 82K OHM 0606	45000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages