Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-N8V240JX Panasonic	RES ARRAY 4 RES 24 OHM 0804	22492
EXB-D10C822J Panasonic	RES ARRAY 8 RES 8.2K OHM 1206	1657
EXB-28V201JX Panasonic	RES ARRAY 4 RES 200 OHM 0804	11359
EXB-V4V184JV Panasonic	RES ARRAY 2 RES 180K OHM 0606	0
EXB-E10C151J Panasonic	RES ARRAY 8 RES 150 OHM 1608	5025
EXB-V4V432JV Panasonic	RES ARRAY 2 RES 4.3K OHM 0606	0
EXB-V4V201JV Panasonic	RES ARRAY 2 RES 200 OHM 0606	0
EXB-V8V104JV Panasonic	RES ARRAY 4 RES 100K OHM 1206	163924
EXB-E10C333J Panasonic	RES ARRAY 8 RES 33K OHM 1608	1794
EXB-2HV621JV Panasonic	RES ARRAY 8 RES 620 OHM 1506	0
EXB-28V203JX Panasonic	RES ARRAY 4 RES 20K OHM 0804	46005
EXB-34V132JV Panasonic	RES ARRAY 2 RES 1.3K OHM 0606	0
EXB-A10P560J Panasonic	RES ARRAY 8 RES 56 OHM 2512	6011
EXB-V8V163JV Panasonic	RES ARRAY 4 RES 16K OHM 1206	0
EXB-38V362JV Panasonic	RES ARRAY 4 RES 3.6K OHM 1206	0
EXB-28V361JX Panasonic	RES ARRAY 4 RES 360 OHM 0804	18990
EXB-18V100JX Panasonic	RES ARRAY 4 RES 10 OHM 0502	0
EXB-18V474JX Panasonic	RES ARRAY 4 RES 470K OHM 0502	9730
EXB-28V122JX Panasonic	RES ARRAY 4 RES 1.2K OHM 0804	1092
EXB-24V164JX Panasonic	RES ARRAY 2 RES 160K OHM 0404	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages