Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V8V102JV Panasonic	RES ARRAY 4 RES 1K OHM 1206	111101
EXB-V4VR000V Panasonic	RES ARRAY 2 RES ZERO OHM 0606	28217
EXB-38V432JV Panasonic	RES ARRAY 4 RES 4.3K OHM 1206	0
EXB-28V680JX Panasonic	RES ARRAY 4 RES 68 OHM 0804	19716
EXB-V4V2R0JV Panasonic	RES ARRAY 2 RES 2 OHM 0606	9970
EXB-E10C334J Panasonic	RES ARRAY 8 RES 330K OHM 1608	8097
EXB-N8V514JX Panasonic	RES ARRAY 4 RES 510K OHM 0804	29790
EXB-D10C152J Panasonic	RES ARRAY 8 RES 1.5K OHM 1206	24500
EXB-14V223JX Panasonic	RES ARRAY 2 RES 22K OHM 0302	12175
EXB-V8V564JV Panasonic	RES ARRAY 4 RES 560K OHM 1206	28730
EXB-V4V434JV Panasonic	RES ARRAY 2 RES 430K OHM 0606	0
EXB-2HV390JV Panasonic	RES ARRAY 8 RES 39 OHM 1506	21709
EXB-14V183JX Panasonic	RES ARRAY 2 RES 18K OHM 0302	0
EXB-34V1R5JV Panasonic	RES ARRAY 2 RES 1.5 OHM 0606	0
EXB-28V5R1JX Panasonic	RES ARRAY 4 RES 5.1 OHM 0804	695
EXB-N8V124JX Panasonic	RES ARRAY 4 RES 120K OHM 0804	36921
EXB-N8V561JX Panasonic	RES ARRAY 4 RES 560 OHM 0804	7316
EXB-2HV152JV Panasonic	RES ARRAY 8 RES 1.5K OHM 1506	3696
EXB-14V331JX Panasonic	RES ARRAY 2 RES 330 OHM 0302	5615
EXB-38V184JV Panasonic	RES ARRAY 4 RES 180K OHM 1206	44540

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages