Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HVR000V Panasonic	RES ARRAY 8 RES ZERO OHM 1506	58955
EXB-2HV620JV Panasonic	RES ARRAY 8 RES 62 OHM 1506	0
EXB-14V392JX Panasonic	RES ARRAY 2 RES 3.9K OHM 0302	10000
EXB-V8V752JV Panasonic	RES ARRAY 4 RES 7.5K OHM 1206	0
EXB-24V7R5JX Panasonic	RES ARRAY 2 RES 7.5 OHM 0404	19784
EXB-38V134JV Panasonic	RES ARRAY 4 RES 130K OHM 1206	0
EXB-2HV243JV Panasonic	RES ARRAY 8 RES 24K OHM 1506	0
EXB-N8V393JX Panasonic	RES ARRAY 4 RES 39K OHM 0804	0
EXB-A10P222J Panasonic	RES ARRAY 8 RES 2.2K OHM 2512	1278
EXB-D10C105J Panasonic	RES ARRAY 8 RES 1M OHM 1206	3604
EXB-V8V514JV Panasonic	RES ARRAY 4 RES 510K OHM 1206	0
EXB-D10C473J Panasonic	RES ARRAY 8 RES 47K OHM 1206	5972
EXB-N8V9R1JX Panasonic	RES ARRAY 4 RES 9.1 OHM 0804	0
EXB-38V334JV Panasonic	RES ARRAY 4 RES 330K OHM 1206	37949
EXB-34V303JV Panasonic	RES ARRAY 2 RES 30K OHM 0606	0
EXB-24V242JX Panasonic	RES ARRAY 2 RES 2.4K OHM 0404	0
EXB-2HV105JV Panasonic	RES ARRAY 8 RES 1M OHM 1506	227600
EXB-2HV473JV Panasonic	RES ARRAY 8 RES 47K OHM 1506	19649
EXB-24V130JX Panasonic	RES ARRAY 2 RES 13 OHM 0404	0
EXB-24V304JX Panasonic	RES ARRAY 2 RES 300K OHM 0404	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages