Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-24V121JX Panasonic	RES ARRAY 2 RES 120 OHM 0404	3962
EXB-N8V105JX Panasonic	RES ARRAY 4 RES 1M OHM 0804	19464
EXB-V4V680JV Panasonic	RES ARRAY 2 RES 68 OHM 0606	13172
EXB-N8V824JX Panasonic	RES ARRAY 4 RES 820K OHM 0804	0
EXB-A10P154J Panasonic	RES ARRAY 8 RES 150K OHM 2512	186
EXB-34V244JV Panasonic	RES ARRAY 2 RES 240K OHM 0606	0
EXB-28V820JX Panasonic	RES ARRAY 4 RES 82 OHM 0804	25520
EXB-24V301JX Panasonic	RES ARRAY 2 RES 300 OHM 0404	0
EXB-V4V3R3JV Panasonic	RES ARRAY 2 RES 3.3 OHM 0606	9729
EXB-Q16P683J Panasonic	RES ARRAY 15 RES 68K OHM 1506	0
EXB-38V220JV Panasonic	RES ARRAY 4 RES 22 OHM 1206	94521
EXB-38V131JV Panasonic	RES ARRAY 4 RES 130 OHM 1206	0
EXB-A10P123J Panasonic	RES ARRAY 8 RES 12K OHM 2512	1769
EXB-V8V360JV Panasonic	RES ARRAY 4 RES 36 OHM 1206	0
EXB-E10C681J Panasonic	RES ARRAY 8 RES 680 OHM 1608	0
EXB-18V680JX Panasonic	RES ARRAY 4 RES 68 OHM 0502	11612
EXB-28V910JX Panasonic	RES ARRAY 4 RES 91 OHM 0804	28000
EXB-N8V4R3JX Panasonic	RES ARRAY 4 RES 4.3 OHM 0804	11683
EXB-34V1R3JV Panasonic	RES ARRAY 2 RES 1.3 OHM 0606	0
EXB-2HV684JV Panasonic	RES ARRAY 8 RES 680K OHM 1506	8823

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages