Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V4V470JV Panasonic	RES ARRAY 2 RES 47 OHM 0606	4538
EXB-34V391JV Panasonic	RES ARRAY 2 RES 390 OHM 0606	33064
EXB-28V132JX Panasonic	RES ARRAY 4 RES 1.3K OHM 0804	4734
EXB-34V364JV Panasonic	RES ARRAY 2 RES 360K OHM 0606	0
EXB-28V111JX Panasonic	RES ARRAY 4 RES 110 OHM 0804	32684
EXB-F6V682G Panasonic	RES ARRAY 3 RES 6.8K OHM 6SIP	6167
EXB-24V512JX Panasonic	RES ARRAY 2 RES 5.1K OHM 0404	0
EXB-28V221JX Panasonic	RES ARRAY 4 RES 220 OHM 0804	101813
EXB-18VR000X Panasonic	RES ARRAY 4 RES ZERO OHM 0502	8290
EXB-14V274JX Panasonic	RES ARRAY 2 RES 270K OHM 0302	0
EXB-24V2R4JX Panasonic	RES ARRAY 2 RES 2.4 OHM 0404	0
EXB-24VR000X Panasonic	RES ARRAY 2 RES ZERO OHM 0404	42300
EXB-24V1R2JX Panasonic	RES ARRAY 2 RES 1.2 OHM 0404	0
EXB-Q16P682J Panasonic	RES ARRAY 15 RES 6.8K OHM 1506	4734
EXB-2HV914JV Panasonic	RES ARRAY 8 RES 910K OHM 1506	0
EXB-A10P274J Panasonic	RES ARRAY 8 RES 270K OHM 2512	0
EXB-V4V301JV Panasonic	RES ARRAY 2 RES 300 OHM 0606	0
EXB-V4V623JV Panasonic	RES ARRAY 2 RES 62K OHM 0606	0
EXB-V4V754JV Panasonic	RES ARRAY 2 RES 750K OHM 0606	0
EXB-N8V360JX Panasonic	RES ARRAY 4 RES 36 OHM 0804	34331

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages