Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-34V562JV Panasonic	RES ARRAY 2 RES 5.6K OHM 0606	3281
EXB-V8V240JV Panasonic	RES ARRAY 4 RES 24 OHM 1206	0
EXB-18V470JX Panasonic	RES ARRAY 4 RES 47 OHM 0502	0
EXB-N8V201JX Panasonic	RES ARRAY 4 RES 200 OHM 0804	6533
EXB-28V8R2JX Panasonic	RES ARRAY 4 RES 8.2 OHM 0804	30000
EXB-N8V152JX Panasonic	RES ARRAY 4 RES 1.5K OHM 0804	9995
EXB-24V560JX Panasonic	RES ARRAY 2 RES 56 OHM 0404	0
EXB-24V203JX Panasonic	RES ARRAY 2 RES 20K OHM 0404	0
EXB-24V241JX Panasonic	RES ARRAY 2 RES 240 OHM 0404	0
EXB-N8V272JX Panasonic	RES ARRAY 4 RES 2.7K OHM 0804	6711
EXB-34V2R2JV Panasonic	RES ARRAY 2 RES 2.2 OHM 0606	0
EXB-34V221JV Panasonic	RES ARRAY 2 RES 220 OHM 0606	45600
EXB-38V124JV Panasonic	RES ARRAY 4 RES 120K OHM 1206	22870
EXB-2HV4R7JV Panasonic	RES ARRAY 8 RES 4.7 OHM 1506	4135
EXB-24V105JX Panasonic	RES ARRAY 2 RES 1M OHM 0404	10961
EXB-38V150JV Panasonic	RES ARRAY 4 RES 15 OHM 1206	13649
EXB-V4V392JV Panasonic	RES ARRAY 2 RES 3.9K OHM 0606	15000
EXB-2HV122JV Panasonic	RES ARRAY 8 RES 1.2K OHM 1506	2530
EXB-18V184JX Panasonic	RES ARRAY 4 RES 180K OHM 0502	9439
EXB-2HV163JV Panasonic	RES ARRAY 8 RES 16K OHM 1506	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages