Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V8V270JV Panasonic	RES ARRAY 4 RES 27 OHM 1206	1015
EXB-2HV623JV Panasonic	RES ARRAY 8 RES 62K OHM 1506	0
EXB-34V163JV Panasonic	RES ARRAY 2 RES 16K OHM 0606	0
EXB-18V274JX Panasonic	RES ARRAY 4 RES 270K OHM 0502	9971
EXB-N8V472JX Panasonic	RES ARRAY 4 RES 4.7K OHM 0804	21190
EXB-34V181JV Panasonic	RES ARRAY 2 RES 180 OHM 0606	35741
EXB-A10P470J Panasonic	RES ARRAY 8 RES 47 OHM 2512	5449
EXB-E10C272J Panasonic	RES ARRAY 8 RES 2.7K OHM 1608	0
EXB-2HV241JV Panasonic	RES ARRAY 8 RES 240 OHM 1506	0
EXB-D10C274J Panasonic	RES ARRAY 8 RES 270K OHM 1206	10000
EXB-A10P333J Panasonic	RES ARRAY 8 RES 33K OHM 2512	3233
EXB-34V334JV Panasonic	RES ARRAY 2 RES 330K OHM 0606	150
EXB-38V1R1JV Panasonic	RES ARRAY 4 RES 1.1 OHM 1206	0
EXB-24V514JX Panasonic	RES ARRAY 2 RES 510K OHM 0404	0
EXB-24V2R2JX Panasonic	RES ARRAY 2 RES 2.2 OHM 0404	28409
EXB-2HV244JV Panasonic	RES ARRAY 8 RES 240K OHM 1506	0
EXB-38V1R8JV Panasonic	RES ARRAY 4 RES 1.8 OHM 1206	25000
EXB-34V2R0JV Panasonic	RES ARRAY 2 RES 2 OHM 0606	0
EXB-E10C393J Panasonic	RES ARRAY 8 RES 39K OHM 1608	0
EXB-N8V913JX Panasonic	RES ARRAY 4 RES 91K OHM 0804	2409

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages