Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V4V822JV Panasonic	RES ARRAY 2 RES 8.2K OHM 0606	22955
EXB-18V122JX Panasonic	RES ARRAY 4 RES 1.2K OHM 0502	8142
EXB-24V1R3JX Panasonic	RES ARRAY 2 RES 1.3 OHM 0404	0
EXB-38V1R6JV Panasonic	RES ARRAY 4 RES 1.6 OHM 1206	0
EXB-24V511JX Panasonic	RES ARRAY 2 RES 510 OHM 0404	0
EXB-34V123JV Panasonic	RES ARRAY 2 RES 12K OHM 0606	35772
EXB-34V222JV Panasonic	RES ARRAY 2 RES 2.2K OHM 0606	60482
EXB-24V332JX Panasonic	RES ARRAY 2 RES 3.3K OHM 0404	3772
EXB-N8V113JX Panasonic	RES ARRAY 4 RES 11K OHM 0804	21575
EXB-2HV334JV Panasonic	RES ARRAY 8 RES 330K OHM 1506	5000
EXB-N8V754JX Panasonic	RES ARRAY 4 RES 750K OHM 0804	38057
EXB-F6E474G Panasonic	RES ARRAY 5 RES 470K OHM 6SIP	6331
EXB-14V272JX Panasonic	RES ARRAY 2 RES 2.7K OHM 0302	20000
EXB-38V200JV Panasonic	RES ARRAY 4 RES 20 OHM 1206	0
EXB-34V363JV Panasonic	RES ARRAY 2 RES 36K OHM 0606	0
EXB-34V2R7JV Panasonic	RES ARRAY 2 RES 2.7 OHM 0606	0
EXB-V4V303JV Panasonic	RES ARRAY 2 RES 30K OHM 0606	0
EXB-E10C683J Panasonic	RES ARRAY 8 RES 68K OHM 1608	0
EXB-A10P821J Panasonic	RES ARRAY 8 RES 820 OHM 2512	5414
EXB-28V162JX Panasonic	RES ARRAY 4 RES 1.6K OHM 0804	6778

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages