Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV134JV Panasonic	RES ARRAY 8 RES 130K OHM 1506	0
EXB-2HV433JV Panasonic	RES ARRAY 8 RES 43K OHM 1506	0
EXB-N8V133JX Panasonic	RES ARRAY 4 RES 13K OHM 0804	34482
EXB-V8V434JV Panasonic	RES ARRAY 4 RES 430K OHM 1206	0
EXB-E10C682J Panasonic	RES ARRAY 8 RES 6.8K OHM 1608	6081
EXB-24V220JX Panasonic	RES ARRAY 2 RES 22 OHM 0404	29980
EXB-38V202JV Panasonic	RES ARRAY 4 RES 2K OHM 1206	0
EXB-N8V183JX Panasonic	RES ARRAY 4 RES 18K OHM 0804	6395
EXB-34V621JV Panasonic	RES ARRAY 2 RES 620 OHM 0606	0
EXB-28V160JX Panasonic	RES ARRAY 4 RES 16 OHM 0804	17197
EXB-2HV272JV Panasonic	RES ARRAY 8 RES 2.7K OHM 1506	8243
EXB-34V182JV Panasonic	RES ARRAY 2 RES 1.8K OHM 0606	37579
EXB-34V6R8JV Panasonic	RES ARRAY 2 RES 6.8 OHM 0606	0
EXB-38V101JV Panasonic	RES ARRAY 4 RES 100 OHM 1206	18360
EXB-34V474JV Panasonic	RES ARRAY 2 RES 470K OHM 0606	15669
EXB-V8V754JV Panasonic	RES ARRAY 4 RES 750K OHM 1206	0
EXB-28V112JX Panasonic	RES ARRAY 4 RES 1.1K OHM 0804	16470
EXB-A10P391J Panasonic	RES ARRAY 8 RES 390 OHM 2512	7689
EXB-Q16P102J Panasonic	RES ARRAY 15 RES 1K OHM 1506	1063
EXB-24V430JX Panasonic	RES ARRAY 2 RES 43 OHM 0404	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages