Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV220JV Panasonic	RES ARRAY 8 RES 22 OHM 1506	0
EXB-2HV822JV Panasonic	RES ARRAY 8 RES 8.2K OHM 1506	11031
EXB-38V224JV Panasonic	RES ARRAY 4 RES 220K OHM 1206	55000
EXB-2HV624JV Panasonic	RES ARRAY 8 RES 620K OHM 1506	0
EXB-V4V360JV Panasonic	RES ARRAY 2 RES 36 OHM 0606	0
EXB-2HV113JV Panasonic	RES ARRAY 8 RES 11K OHM 1506	0
EXB-34V103JV Panasonic	RES ARRAY 2 RES 10K OHM 0606	96215
EXB-34V3R9JV Panasonic	RES ARRAY 2 RES 3.9 OHM 0606	0
EXB-28V683JX Panasonic	RES ARRAY 4 RES 68K OHM 0804	10000
EXB-38V431JV Panasonic	RES ARRAY 4 RES 430 OHM 1206	0
EXB-28N100JX Panasonic	RES ARRAY 4 RES 10 OHM 0804	17368
EXB-2HV222JV Panasonic	RES ARRAY 8 RES 2.2K OHM 1506	50937
EXB-V4V132JV Panasonic	RES ARRAY 2 RES 1.3K OHM 0606	0
EXB-V4V823JV Panasonic	RES ARRAY 2 RES 82K OHM 0606	25000
EXB-28V1R3JX Panasonic	RES ARRAY 4 RES 1.3 OHM 0804	19798
EXB-24V113JX Panasonic	RES ARRAY 2 RES 11K OHM 0404	0
EXB-24V181JX Panasonic	RES ARRAY 2 RES 180 OHM 0404	18990
EXB-V4V131JV Panasonic	RES ARRAY 2 RES 130 OHM 0606	0
EXB-14V680JX Panasonic	RES ARRAY 2 RES 68 OHM 0302	5075
EXB-24V103JX Panasonic	RES ARRAY 2 RES 10K OHM 0404	150989

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages