Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-38V364JV Panasonic	RES ARRAY 4 RES 360K OHM 1206	0
EXB-N8V1R6JX Panasonic	RES ARRAY 4 RES 1.6 OHM 0804	0
EXB-28V912JX Panasonic	RES ARRAY 4 RES 9.1K OHM 0804	0
EXB-28V241JX Panasonic	RES ARRAY 4 RES 240 OHM 0804	23175
EXB-A10P473J Panasonic	RES ARRAY 8 RES 47K OHM 2512	44
EXB-E10C561J Panasonic	RES ARRAY 8 RES 560 OHM 1608	1376
EXB-28V100JX Panasonic	RES ARRAY 4 RES 10 OHM 0804	17056
EXB-24V684JX Panasonic	RES ARRAY 2 RES 680K OHM 0404	0
EXB-F10V474G Panasonic	RES ARRAY 5 RES 470K OHM 10SIP	2351
EXB-28V2R2JX Panasonic	RES ARRAY 4 RES 2.2 OHM 0804	0
EXB-N8V1R0JX Panasonic	RES ARRAY 4 RES 1 OHM 0804	8552
EXB-38V474JV Panasonic	RES ARRAY 4 RES 470K OHM 1206	26471
EXB-28V130JX Panasonic	RES ARRAY 4 RES 13 OHM 0804	20000
EXB-18V334JX Panasonic	RES ARRAY 4 RES 330K OHM 0502	5165
EXB-2HV273JV Panasonic	RES ARRAY 8 RES 27K OHM 1506	5000
EXB-38V121JV Panasonic	RES ARRAY 4 RES 120 OHM 1206	26481
EXB-38V201JV Panasonic	RES ARRAY 4 RES 200 OHM 1206	0
EXB-38V7R5JV Panasonic	RES ARRAY 4 RES 7.5 OHM 1206	4155
EXB-E10C331J Panasonic	RES ARRAY 8 RES 330 OHM 1608	6440
EXB-34V911JV Panasonic	RES ARRAY 2 RES 910 OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages