Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V4V1R2JV Panasonic	RES ARRAY 2 RES 1.2 OHM 0606	9990
EXB-V8V470JV Panasonic	RES ARRAY 4 RES 47 OHM 1206	17992
EXB-A10P152J Panasonic	RES ARRAY 8 RES 1.5K OHM 2512	628
EXB-34VR000V Panasonic	RES ARRAY 2 RES ZERO OHM 0606	20735
EXB-38V683JV Panasonic	RES ARRAY 4 RES 68K OHM 1206	9150
EXB-N8V112JX Panasonic	RES ARRAY 4 RES 1.1K OHM 0804	0
EXB-14V153JX Panasonic	RES ARRAY 2 RES 15K OHM 0302	9900
EXB-F10V683G Panasonic	RES ARRAY 5 RES 68K OHM 10SIP	2843
EXB-V4V104JV Panasonic	RES ARRAY 2 RES 100K OHM 0606	20589
EXB-34V243JV Panasonic	RES ARRAY 2 RES 24K OHM 0606	0
EXB-38V680JV Panasonic	RES ARRAY 4 RES 68 OHM 1206	18070
EXB-E10C473J Panasonic	RES ARRAY 8 RES 47K OHM 1608	1965
EXB-28V304JX Panasonic	RES ARRAY 4 RES 300K OHM 0804	274
EXB-28V152JX Panasonic	RES ARRAY 4 RES 1.5K OHM 0804	56357
EXB-A10P332J Panasonic	RES ARRAY 8 RES 3.3K OHM 2512	295
EXB-28V222JX Panasonic	RES ARRAY 4 RES 2.2K OHM 0804	551058
EXB-V4V122JV Panasonic	RES ARRAY 2 RES 1.2K OHM 0606	21
EXB-28V101JX Panasonic	RES ARRAY 4 RES 100 OHM 0804	301185
EXB-V8V430JV Panasonic	RES ARRAY 4 RES 43 OHM 1206	0
EXB-V4V241JV Panasonic	RES ARRAY 2 RES 240 OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages