Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-2HV300JV Panasonic	RES ARRAY 8 RES 30 OHM 1506	0
EXB-D10C183J Panasonic	RES ARRAY 8 RES 18K OHM 1206	5000
EXB-34V333JV Panasonic	RES ARRAY 2 RES 33K OHM 0606	45000
EXB-38V182JV Panasonic	RES ARRAY 4 RES 1.8K OHM 1206	2343
EXB-18V471JX Panasonic	RES ARRAY 4 RES 470 OHM 0502	18819
EXB-N8V274JX Panasonic	RES ARRAY 4 RES 270K OHM 0804	30000
EXB-D10C122J Panasonic	RES ARRAY 8 RES 1.2K OHM 1206	7620
EXB-24V433JX Panasonic	RES ARRAY 2 RES 43K OHM 0404	10000
EXB-24V4R3JX Panasonic	RES ARRAY 2 RES 4.3 OHM 0404	137505
EXB-V4V910JV Panasonic	RES ARRAY 2 RES 91 OHM 0606	0
EXB-V4V130JV Panasonic	RES ARRAY 2 RES 13 OHM 0606	0
EXB-38V333JV Panasonic	RES ARRAY 4 RES 33K OHM 1206	136862
EXB-V4V363JV Panasonic	RES ARRAY 2 RES 36K OHM 0606	0
EXB-24V823JX Panasonic	RES ARRAY 2 RES 82K OHM 0404	18137
EXB-38V273JV Panasonic	RES ARRAY 4 RES 27K OHM 1206	6555
EXB-28V560JX Panasonic	RES ARRAY 4 RES 56 OHM 0804	9800
EXB-24V3R0JX Panasonic	RES ARRAY 2 RES 3 OHM 0404	70000
EXB-34V104JV Panasonic	RES ARRAY 2 RES 100K OHM 0606	30
EXB-N8V911JX Panasonic	RES ARRAY 4 RES 910 OHM 0804	916
EXB-18V224JX Panasonic	RES ARRAY 4 RES 220K OHM 0502	8920

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages