Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-24V624JX Panasonic	RES ARRAY 2 RES 620K OHM 0404	0
EXB-N8V620JX Panasonic	RES ARRAY 4 RES 62 OHM 0804	29862
EXB-N8V362JX Panasonic	RES ARRAY 4 RES 3.6K OHM 0804	31113
EXB-V4V334JV Panasonic	RES ARRAY 2 RES 330K OHM 0606	4518
EXB-V4V162JV Panasonic	RES ARRAY 2 RES 1.6K OHM 0606	0
EXB-38V303JV Panasonic	RES ARRAY 4 RES 30K OHM 1206	0
EXB-24V132JX Panasonic	RES ARRAY 2 RES 1.3K OHM 0404	0
EXB-E10C223J Panasonic	RES ARRAY 8 RES 22K OHM 1608	9719
EXB-V8V1R3JV Panasonic	RES ARRAY 4 RES 1.3 OHM 1206	24361
EXB-2HV392JV Panasonic	RES ARRAY 8 RES 3.9K OHM 1506	4662
EXB-2HV472JV Panasonic	RES ARRAY 8 RES 4.7K OHM 1506	45712
EXB-V4V514JV Panasonic	RES ARRAY 2 RES 510K OHM 0606	0
EXB-E10C102J Panasonic	RES ARRAY 8 RES 1K OHM 1608	13025
EXB-14V821JX Panasonic	RES ARRAY 2 RES 820 OHM 0302	0
EXB-2HV394JV Panasonic	RES ARRAY 8 RES 390K OHM 1506	3990
EXB-V4V681JV Panasonic	RES ARRAY 2 RES 680 OHM 0606	16880
EXB-24V152JX Panasonic	RES ARRAY 2 RES 1.5K OHM 0404	5662
EXB-Q16P223J Panasonic	RES ARRAY 15 RES 22K OHM 1506	36514
EXB-38V752JV Panasonic	RES ARRAY 4 RES 7.5K OHM 1206	0
EXB-14V273JX Panasonic	RES ARRAY 2 RES 27K OHM 0302	16004

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages