Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-24V150JX Panasonic	RES ARRAY 2 RES 15 OHM 0404	2403
EXB-V8V151JV Panasonic	RES ARRAY 4 RES 150 OHM 1206	43990
EXB-V8V223JV Panasonic	RES ARRAY 4 RES 22K OHM 1206	63808
EXB-V4V164JV Panasonic	RES ARRAY 2 RES 160K OHM 0606	0
EXB-E10C122J Panasonic	RES ARRAY 8 RES 1.2K OHM 1608	6164
EXB-38V684JV Panasonic	RES ARRAY 4 RES 680K OHM 1206	17115
EXB-24V240JX Panasonic	RES ARRAY 2 RES 24 OHM 0404	0
EXB-Q16P333J Panasonic	RES ARRAY 15 RES 33K OHM 1506	2576
EXB-N8V431JX Panasonic	RES ARRAY 4 RES 430 OHM 0804	25127
EXB-N8V912JX Panasonic	RES ARRAY 4 RES 9.1K OHM 0804	27834
EXB-V8V302JV Panasonic	RES ARRAY 4 RES 3K OHM 1206	0
EXB-34V433JV Panasonic	RES ARRAY 2 RES 43K OHM 0606	0
EXB-34V3R6JV Panasonic	RES ARRAY 2 RES 3.6 OHM 0606	0
EXB-28V391JX Panasonic	RES ARRAY 4 RES 390 OHM 0804	26708
EXB-24V912JX Panasonic	RES ARRAY 2 RES 9.1K OHM 0404	0
EXB-34V272JV Panasonic	RES ARRAY 2 RES 2.7K OHM 0606	0
EXB-28V133JX Panasonic	RES ARRAY 4 RES 13K OHM 0804	19625
EXB-18V331JX Panasonic	RES ARRAY 4 RES 330 OHM 0502	14682
EXB-14V563JX Panasonic	RES ARRAY 2 RES 56K OHM 0302	0
EXB-24V271JX Panasonic	RES ARRAY 2 RES 270 OHM 0404	17269

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages