Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-E10C124J Panasonic	RES ARRAY 8 RES 120K OHM 1608	7809
EXB-Q16P473J Panasonic	RES ARRAY 15 RES 47K OHM 1506	2810
EXB-N8V1R5JX Panasonic	RES ARRAY 4 RES 1.5 OHM 0804	28670
EXB-18V682JX Panasonic	RES ARRAY 4 RES 6.8K OHM 0502	7924
EXB-N8V753JX Panasonic	RES ARRAY 4 RES 75K OHM 0804	19062
EXB-D10C684J Panasonic	RES ARRAY 8 RES 680K OHM 1206	9703
EXB-2HV181JV Panasonic	RES ARRAY 8 RES 180 OHM 1506	19668
EXB-2HV223JV Panasonic	RES ARRAY 8 RES 22K OHM 1506	87302
EXB-V4V243JV Panasonic	RES ARRAY 2 RES 24K OHM 0606	0
EXB-2HV682JV Panasonic	RES ARRAY 8 RES 6.8K OHM 1506	4289
EXB-34V150JV Panasonic	RES ARRAY 2 RES 15 OHM 0606	57220
EXB-2HV511JV Panasonic	RES ARRAY 8 RES 510 OHM 1506	0
EXB-18V103JX Panasonic	RES ARRAY 4 RES 10K OHM 0502	2704
EXB-24V393JX Panasonic	RES ARRAY 2 RES 39K OHM 0404	8290
EXB-14V150JX Panasonic	RES ARRAY 2 RES 15 OHM 0302	74742
EXB-V4V364JV Panasonic	RES ARRAY 2 RES 360K OHM 0606	0
EXB-E10C181J Panasonic	RES ARRAY 8 RES 180 OHM 1608	5015
EXB-18V124JX Panasonic	RES ARRAY 4 RES 120K OHM 0502	0
EXB-14V393JX Panasonic	RES ARRAY 2 RES 39K OHM 0302	19990
EXB-24V124JX Panasonic	RES ARRAY 2 RES 120K OHM 0404	10000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages