Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-N8V432JX Panasonic	RES ARRAY 4 RES 4.3K OHM 0804	39605
EXB-2HV102JV Panasonic	RES ARRAY 8 RES 1K OHM 1506	85935
EXB-34V681JV Panasonic	RES ARRAY 2 RES 680 OHM 0606	49649
EXB-38V4R7JV Panasonic	RES ARRAY 4 RES 4.7 OHM 1206	17822
EXB-V4V362JV Panasonic	RES ARRAY 2 RES 3.6K OHM 0606	0
EXB-V4V510JV Panasonic	RES ARRAY 2 RES 51 OHM 0606	0
EXB-V8V274JV Panasonic	RES ARRAY 4 RES 270K OHM 1206	25000
EXB-V8V110JV Panasonic	RES ARRAY 4 RES 11 OHM 1206	0
EXB-N8V3R6JX Panasonic	RES ARRAY 4 RES 3.6 OHM 0804	19850
EXB-V4V390JV Panasonic	RES ARRAY 2 RES 39 OHM 0606	1090
EXB-34V1R2JV Panasonic	RES ARRAY 2 RES 1.2 OHM 0606	0
EXB-A10P331J Panasonic	RES ARRAY 8 RES 330 OHM 2512	3993
EXB-28V1R6JX Panasonic	RES ARRAY 4 RES 1.6 OHM 0804	18900
EXB-34V623JV Panasonic	RES ARRAY 2 RES 62K OHM 0606	0
EXB-14V560JX Panasonic	RES ARRAY 2 RES 56 OHM 0302	5586
EXB-2HV470JV Panasonic	RES ARRAY 8 RES 47 OHM 1506	14955
EXB-2HV823JV Panasonic	RES ARRAY 8 RES 82K OHM 1506	11985
EXB-2HV2R7JV Panasonic	RES ARRAY 8 RES 2.7 OHM 1506	0
EXB-34V470JV Panasonic	RES ARRAY 2 RES 47 OHM 0606	51934
EXB-2HV1R2JV Panasonic	RES ARRAY 8 RES 1.2 OHM 1506	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages