Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V4V2R2JV Panasonic	RES ARRAY 2 RES 2.2 OHM 0606	4295
EXB-38V114JV Panasonic	RES ARRAY 4 RES 110K OHM 1206	0
EXB-V8V122JV Panasonic	RES ARRAY 4 RES 1.2K OHM 1206	0
EXB-V8V622JV Panasonic	RES ARRAY 4 RES 6.2K OHM 1206	0
EXB-28V110JX Panasonic	RES ARRAY 4 RES 11 OHM 0804	143
EXB-A10P272J Panasonic	RES ARRAY 8 RES 2.7K OHM 2512	11116
EXB-V8V121JV Panasonic	RES ARRAY 4 RES 120 OHM 1206	19060
EXB-A10P564J Panasonic	RES ARRAY 8 RES 560K OHM 2512	7413
EXB-V8V103JV Panasonic	RES ARRAY 4 RES 10K OHM 1206	230531
EXB-38V3R3JV Panasonic	RES ARRAY 4 RES 3.3 OHM 1206	0
EXB-2HV363JV Panasonic	RES ARRAY 8 RES 36K OHM 1506	0
EXB-38V6R2JV Panasonic	RES ARRAY 4 RES 6.2 OHM 1206	9991
EXB-2HV224JV Panasonic	RES ARRAY 8 RES 220K OHM 1506	11257
EXB-28V240JX Panasonic	RES ARRAY 4 RES 24 OHM 0804	17860
EXB-N8V164JX Panasonic	RES ARRAY 4 RES 160K OHM 0804	0
EXB-38V274JV Panasonic	RES ARRAY 4 RES 270K OHM 1206	15000
EXB-N8V433JX Panasonic	RES ARRAY 4 RES 43K OHM 0804	0
EXB-28V824JX Panasonic	RES ARRAY 4 RES 820K OHM 0804	0
EXB-V8V150JV Panasonic	RES ARRAY 4 RES 15 OHM 1206	107
EXB-V4V203JV Panasonic	RES ARRAY 2 RES 20K OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages