Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-N8V361JX Panasonic	RES ARRAY 4 RES 360 OHM 0804	5334
EXB-2HV561JV Panasonic	RES ARRAY 8 RES 560 OHM 1506	0
EXB-E10C154J Panasonic	RES ARRAY 8 RES 150K OHM 1608	11065
EXB-24V224JX Panasonic	RES ARRAY 2 RES 220K OHM 0404	14440
EXB-24V470JX Panasonic	RES ARRAY 2 RES 47 OHM 0404	9897
EXB-Q16P151J Panasonic	RES ARRAY 15 RES 150 OHM 1506	0
EXB-V4V331JV Panasonic	RES ARRAY 2 RES 330 OHM 0606	11521
EXB-2HV362JV Panasonic	RES ARRAY 8 RES 3.6K OHM 1506	0
EXB-38V300JV Panasonic	RES ARRAY 4 RES 30 OHM 1206	0
EXB-14V224JX Panasonic	RES ARRAY 2 RES 220K OHM 0302	0
EXB-24V911JX Panasonic	RES ARRAY 2 RES 910 OHM 0404	0
EXB-2HV184JV Panasonic	RES ARRAY 8 RES 180K OHM 1506	5754
EXB-2HV242JV Panasonic	RES ARRAY 8 RES 2.4K OHM 1506	0
EXB-N8V621JX Panasonic	RES ARRAY 4 RES 620 OHM 0804	29660
EXB-34V102JV Panasonic	RES ARRAY 2 RES 1K OHM 0606	95050
EXB-28V120JX Panasonic	RES ARRAY 4 RES 12 OHM 0804	0
EXB-D10C151J Panasonic	RES ARRAY 8 RES 150 OHM 1206	8427
EXB-28V220JX Panasonic	RES ARRAY 4 RES 22 OHM 0804	630168
EXB-34V5R1JV Panasonic	RES ARRAY 2 RES 5.1 OHM 0606	0
EXB-38V242JV Panasonic	RES ARRAY 4 RES 2.4K OHM 1206	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages