Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-Q16P152J Panasonic	RES ARRAY 15 RES 1.5K OHM 1506	9596
EXB-24V620JX Panasonic	RES ARRAY 2 RES 62 OHM 0404	0
EXB-V4V752JV Panasonic	RES ARRAY 2 RES 7.5K OHM 0606	0
EXB-V8V510JV Panasonic	RES ARRAY 4 RES 51 OHM 1206	0
EXB-A10P682J Panasonic	RES ARRAY 8 RES 6.8K OHM 2512	16298
EXB-24V750JX Panasonic	RES ARRAY 2 RES 75 OHM 0404	0
EXB-E10C221J Panasonic	RES ARRAY 8 RES 220 OHM 1608	68172
EXB-28V681JX Panasonic	RES ARRAY 4 RES 680 OHM 0804	21041
EXB-18V150JX Panasonic	RES ARRAY 4 RES 15 OHM 0502	9308
EXB-24V134JX Panasonic	RES ARRAY 2 RES 130K OHM 0404	0
EXB-24V334JX Panasonic	RES ARRAY 2 RES 330K OHM 0404	20000
EXB-28V5R6JX Panasonic	RES ARRAY 4 RES 5.6 OHM 0804	14548
EXB-2HV6R8JV Panasonic	RES ARRAY 8 RES 6.8 OHM 1506	9479
EXB-N8V242JX Panasonic	RES ARRAY 4 RES 2.4K OHM 0804	20000
EXB-14V562JX Panasonic	RES ARRAY 2 RES 5.6K OHM 0302	18627
EXB-V4V820JV Panasonic	RES ARRAY 2 RES 82 OHM 0606	13984
EXB-34V361JV Panasonic	RES ARRAY 2 RES 360 OHM 0606	0
EXB-34V472JV Panasonic	RES ARRAY 2 RES 4.7K OHM 0606	60695
EXB-34V200JV Panasonic	RES ARRAY 2 RES 20 OHM 0606	0
EXB-28V360JX Panasonic	RES ARRAY 4 RES 36 OHM 0804	3193

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages