Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MNR14ERAPJ510 ROHM Semiconductor	RES ARRAY 4 RES 51 OHM 1206	7
MNR14ERAPJ680 ROHM Semiconductor	RES ARRAY 4 RES 68 OHM 1206	3004
MNR04MRAPJ300 ROHM Semiconductor	RES ARRAY 4 RES 30 OHM 0804	19195
MNR14ERAPJ200 ROHM Semiconductor	RES ARRAY 4 RES 20 OHM 1206	6260
MNR34J5ABJ221 ROHM Semiconductor	RES ARRAY 4 RES 220 OHM 2012	1
MNR14ERAPJ242 ROHM Semiconductor	RES ARRAY 4 RES 2.4K OHM 1206	0
MNR12ERAPJ331 ROHM Semiconductor	RES ARRAY 2 RES 330 OHM 0606	0
MNR14ERAPJ564 ROHM Semiconductor	RES ARRAY 4 RES 560K OHM 1206	629
MNR04MRAPJ122 ROHM Semiconductor	RES ARRAY 4 RES 1.2K OHM 0804	5058
MNR14ERAPJ562 ROHM Semiconductor	RES ARRAY 4 RES 5.6K OHM 1206	4650
MNR15ERRPJ272 ROHM Semiconductor	RES ARRAY 8 RES 2.7K OHM 1206	2965
MNR14ERAPJ912 ROHM Semiconductor	RES ARRAY 4 RES 9.1K OHM 1206	1860
MNR15ERRPJ511 ROHM Semiconductor	RES ARRAY 8 RES 510 OHM 1206	900
MNR14ERAPJ432 ROHM Semiconductor	RES ARRAY 4 RES 4.3K OHM 1206	9231
MNR15ERRPJ391 ROHM Semiconductor	RES ARRAY 8 RES 390 OHM 1206	500
MNR18ERAPJ203 ROHM Semiconductor	RES ARRAY 8 RES 20K OHM 1606	627
MNR04MRAPJ151 ROHM Semiconductor	RES ARRAY 4 RES 150 OHM 0804	172
MNR18ERAPJ302 ROHM Semiconductor	RES ARRAY 8 RES 3K OHM 1606	26
MNR14ERAPJ244 ROHM Semiconductor	RES ARRAY 4 RES 240K OHM 1206	0
MNR18ERAPJ471 ROHM Semiconductor	RES ARRAY 8 RES 470 OHM 1606	1431

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages