Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MNR14ERAPJ153 ROHM Semiconductor	RES ARRAY 4 RES 15K OHM 1206	1218
MNR14ERAPJ130 ROHM Semiconductor	RES ARRAY 4 RES 13 OHM 1206	9990
MNR18ERAPJ821 ROHM Semiconductor	RES ARRAY 8 RES 820 OHM 1606	9585
MNR15ERRPJ151 ROHM Semiconductor	RES ARRAY 8 RES 150 OHM 1206	7
MNR04MRAPJ100 ROHM Semiconductor	RES ARRAY 4 RES 10 OHM 0804	17
MNR14ERAPJ301 ROHM Semiconductor	RES ARRAY 4 RES 300 OHM 1206	541
MNR14ERAPJ183 ROHM Semiconductor	RES ARRAY 4 RES 18K OHM 1206	48
MNR14ERAPJ161 ROHM Semiconductor	RES ARRAY 4 RES 160 OHM 1206	7181
MNR12ERAPJ471 ROHM Semiconductor	RES ARRAY 2 RES 470 OHM 0606	489
MNR14ERAPJ202 ROHM Semiconductor	RES ARRAY 4 RES 2K OHM 1206	0
MNR15ERRPJ333 ROHM Semiconductor	RES ARRAY 8 RES 33K OHM 1206	3
MNR18ERAPJ620 ROHM Semiconductor	RES ARRAY 8 RES 62 OHM 1606	3119
MNR04M0ABJ270 ROHM Semiconductor	RES ARRAY 4 RES 27 OHM 0804	104
MNR14ERAPJ131 ROHM Semiconductor	RES ARRAY 4 RES 130 OHM 1206	5659
MNR14ERAPJ222 ROHM Semiconductor	RES ARRAY 4 RES 2.2K OHM 1206	10
MNR12ERAPJ224 ROHM Semiconductor	RES ARRAY 2 RES 220K OHM 0606	359
MNR34J5ABJ330 ROHM Semiconductor	RES ARRAY 4 RES 33 OHM 2012	2090
MNR14ERAPJ431 ROHM Semiconductor	RES ARRAY 4 RES 430 OHM 1206	15
MNR14ERAPJ514 ROHM Semiconductor	RES ARRAY 4 RES 510K OHM 1206	4515
MNR12ERAPJ560 ROHM Semiconductor	RES ARRAY 2 RES 56 OHM 0606	910

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages