Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MNR04MRAPJ221 ROHM Semiconductor	RES ARRAY 4 RES 220 OHM 0804	14037
MNR34J5ABJ274 ROHM Semiconductor	RES ARRAY 4 RES 270K OHM 2012	1839
MNR14ERAPJ181 ROHM Semiconductor	RES ARRAY 4 RES 180 OHM 1206	80
MNR12ERAPJ100 ROHM Semiconductor	RES ARRAY 2 RES 10 OHM 0606	1
MNR15ERRPJ331 ROHM Semiconductor	RES ARRAY 8 RES 330 OHM 1206	6608
MNR14ERAPJ821 ROHM Semiconductor	RES ARRAY 4 RES 820 OHM 1206	522
MNR14ERAPJ303 ROHM Semiconductor	RES ARRAY 4 RES 30K OHM 1206	1049
MNR14ERAPJ433 ROHM Semiconductor	RES ARRAY 4 RES 43K OHM 1206	0
MNR02MRAPJ220 ROHM Semiconductor	RES ARRAY 2 RES 22 OHM 0404	1277
MNR04MRAPJ820 ROHM Semiconductor	RES ARRAY 4 RES 82 OHM 0804	3424
MNR12ERAPJ270 ROHM Semiconductor	RES ARRAY 2 RES 27 OHM 0606	0
MNR04MRAPJ272 ROHM Semiconductor	RES ARRAY 4 RES 2.7K OHM 0804	5428
MNR14ERAPJ334 ROHM Semiconductor	RES ARRAY 4 RES 330K OHM 1206	7329
MNR12ERAPJ101 ROHM Semiconductor	RES ARRAY 2 RES 100 OHM 0606	77
MNR12ERAPJ104 ROHM Semiconductor	RES ARRAY 2 RES 100K OHM 0606	435
MNR14ERAPJ470 ROHM Semiconductor	RES ARRAY 4 RES 47 OHM 1206	0
MNR14ERAPJ150 ROHM Semiconductor	RES ARRAY 4 RES 15 OHM 1206	4441
MNR14ERAPJ272 ROHM Semiconductor	RES ARRAY 4 RES 2.7K OHM 1206	20
MNR14ERAPJ682 ROHM Semiconductor	RES ARRAY 4 RES 6.8K OHM 1206	14
MNR14ERAPJ6R8 ROHM Semiconductor	RES ARRAY 4 RES 6.8 OHM 1206	4220

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages