Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MNR15ERRPJ182 ROHM Semiconductor	RES ARRAY 8 RES 1.8K OHM 1206	335
MNR14ERAPJ152 ROHM Semiconductor	RES ARRAY 4 RES 1.5K OHM 1206	2468
MNR14ERAPJ684 ROHM Semiconductor	RES ARRAY 4 RES 680K OHM 1206	133
MNR12ERAPJ223 ROHM Semiconductor	RES ARRAY 2 RES 22K OHM 0606	6176
MNR12ERAPJ473 ROHM Semiconductor	RES ARRAY 2 RES 47K OHM 0606	3290
MNR34J5ABJ223 ROHM Semiconductor	RES ARRAY 4 RES 22K OHM 2012	1
MNR14ERAPJ204 ROHM Semiconductor	RES ARRAY 4 RES 200K OHM 1206	2671
MNR12ERAPJ470 ROHM Semiconductor	RES ARRAY 2 RES 47 OHM 0606	144
MNR14ERAPJ560 ROHM Semiconductor	RES ARRAY 4 RES 56 OHM 1206	26
MNR14ERAPJ154 ROHM Semiconductor	RES ARRAY 4 RES 150K OHM 1206	9500
MNR02MRAPJ473 ROHM Semiconductor	RES ARRAY 2 RES 47K OHM 0404	11
MNR18ERAPJ680 ROHM Semiconductor	RES ARRAY 8 RES 68 OHM 1606	1
MNR14ERAPJ513 ROHM Semiconductor	RES ARRAY 4 RES 51K OHM 1206	2356
MNR15ERRPJ101 ROHM Semiconductor	RES ARRAY 8 RES 100 OHM 1206	4114
MNR14ERAPJ750 ROHM Semiconductor	RES ARRAY 4 RES 75 OHM 1206	0
MNR18ERAPJ822 ROHM Semiconductor	RES ARRAY 8 RES 8.2K OHM 1606	14195
MNR14ERAPJ123 ROHM Semiconductor	RES ARRAY 4 RES 12K OHM 1206	280
MNR18ERAPJ360 ROHM Semiconductor	RES ARRAY 8 RES 36 OHM 1606	4635
MNR14ERAPJ2R2 ROHM Semiconductor	RES ARRAY 4 RES 2.2 OHM 1206	4774
MNR14ERAPJ474 ROHM Semiconductor	RES ARRAY 4 RES 470K OHM 1206	180

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages