Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
MNR14ERAPJ392 ROHM Semiconductor	RES ARRAY 4 RES 3.9K OHM 1206	3678
MNR04MRAPJ333 ROHM Semiconductor	RES ARRAY 4 RES 33K OHM 0804	80
MNR14ERAPJ561 ROHM Semiconductor	RES ARRAY 4 RES 560 OHM 1206	4140
MNR18ERAPJ513 ROHM Semiconductor	RES ARRAY 8 RES 51K OHM 1606	2864
MNR14ERAPJ300 ROHM Semiconductor	RES ARRAY 4 RES 30 OHM 1206	985
MNR12ERAPJ153 ROHM Semiconductor	RES ARRAY 2 RES 15K OHM 0606	6760
MNR14ERAPJ822 ROHM Semiconductor	RES ARRAY 4 RES 8.2K OHM 1206	2468
MNR15ERRPJ822 ROHM Semiconductor	RES ARRAY 8 RES 8.2K OHM 1206	2467
MNR14ERAPJ622 ROHM Semiconductor	RES ARRAY 4 RES 6.2K OHM 1206	5
MNR12ERAPJ330 ROHM Semiconductor	RES ARRAY 2 RES 33 OHM 0606	14645
MNR18ERAPJ240 ROHM Semiconductor	RES ARRAY 8 RES 24 OHM 1606	12
MNR18ERAPJ221 ROHM Semiconductor	RES ARRAY 8 RES 220 OHM 1606	2351
MNR14ERAPJ393 ROHM Semiconductor	RES ARRAY 4 RES 39K OHM 1206	0
MNR14ERAPJ133 ROHM Semiconductor	RES ARRAY 4 RES 13K OHM 1206	4649
MNR18ERAPJ121 ROHM Semiconductor	RES ARRAY 8 RES 120 OHM 1606	1807
MNR15ERRPJ561 ROHM Semiconductor	RES ARRAY 8 RES 560 OHM 1206	1679
MNR15ERRPJ221 ROHM Semiconductor	RES ARRAY 8 RES 220 OHM 1206	4265
MNR04MRAPJ682 ROHM Semiconductor	RES ARRAY 4 RES 6.8K OHM 0804	2435
MNR12ERAPJ222 ROHM Semiconductor	RES ARRAY 2 RES 2.2K OHM 0606	1842
MNR14ERAPJ270 ROHM Semiconductor	RES ARRAY 4 RES 27 OHM 1206	3000

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages