Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
M8340109K1002FCD03 Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	84
CRA06S08324K0JTA Vishay / Dale	RES ARRAY 4 RES 24K OHM 1206	2081
CRA06E08333R0FTA Vishay / Dale	RES ARRAY 4 RES 33 OHM 1206	40000
CSC08A031K50GPA Vishay / Dale	RES ARRAY 4 RES 1.5K OHM 8SIP	0
MSP06C011K00GEJ Vishay / Dale	RES ARRAY 5 RES 1K OHM 6SIP	0
CSC09B01910RGPA Vishay / Dale	RES ARRAY 8 RES 910 OHM 9SIP	0
CRA04P083150RJTD Vishay / Dale	RES ARRAY 4 RES 150 OHM 0804	2663
SOMC160382R0GEA Vishay / Dale	RES ARRAY 8 RES 82 OHM 16SOIC	0
MSP06A0312K0GEJ Vishay / Dale	RES ARRAY 3 RES 12K OHM 6SIP	0
SOMC160122K0JEA Vishay / Dale	RES ARRAY 15 RES 22K OHM 16SOIC	0
CSC08A035K60GPA Vishay / Dale	RES ARRAY 4 RES 5.6K OHM 8SIP	0
MSP06A03100KGEJ Vishay / Dale	RES ARRAY 3 RES 100K OHM 6SIP	0
M8340108K1001GGD03 Vishay / Dale	RES ARRAY 4 RES 1K OHM 8SIP	140
MSP10A0310K0GEJ Vishay / Dale	RES ARRAY 5 RES 10K OHM 10SIP	0
M8340104K1002FGD03 Vishay / Dale	RES ARRAY 3 RES 10K OHM 6SIP	0
CSC08A0333R0GEK Vishay / Dale	RES ARRAY 4 RES 33 OHM 8SIP	0
MDP1603270RGE04 Vishay / Dale	RES ARRAY 8 RES 270 OHM 16DIP	0
MSP10A011K50FEJ Vishay / Dale	RES ARRAY 9 RES 1.5K OHM 10SIP	0
CSC08B03470RGPA Vishay / Dale	RES ARRAY 4 RES 470 OHM 8SIP	0
CSC06A01270RGPA Vishay / Dale	RES ARRAY 5 RES 270 OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages