Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC10A01220RGEK Vishay / Dale	RES ARRAY 9 RES 220 OHM 10SIP	2000
MSP10A01390RGEJ Vishay / Dale	RES ARRAY 9 RES 390 OHM 10SIP	0
MDP1403680RGE04 Vishay / Dale	RES ARRAY 7 RES 680 OHM 14DIP	0
SOMC160347K0GEA Vishay / Dale	RES ARRAY 8 RES 47K OHM 16SOIC	1015
CRA06P08330K0JTA Vishay / Dale	RES ARRAY 4 RES 30K OHM 1206	0
MDP160122K0GE04 Vishay / Dale	RES ARRAY 15 RES 22K OHM 16DIP	0
MDP1601390RGE04 Vishay / Dale	RES ARRAY 15 RES 390 OHM 16DIP	0
CRA04S083130RJTD Vishay / Dale	RES ARRAY 4 RES 130 OHM 0804	21560
MDP140351R0GE04 Vishay / Dale	RES ARRAY 7 RES 51 OHM 14DIP	0
CSC06A03330RGPA Vishay / Dale	RES ARRAY 3 RES 330 OHM 6SIP	0
SOMC160115K0GEA Vishay / Dale	RES ARRAY 15 RES 15K OHM 16SOIC	0
MSP10A0133K0FEJ Vishay / Dale	RES ARRAY 9 RES 33K OHM 10SIP	0
SOMC1403180RGEA Vishay / Dale	RES ARRAY 7 RES 180 OHM 14SOIC	0
SOMC14011K50GEA Vishay / Dale	RES ARRAY 13 RES 1.5K OHM 14SOIC	0
CRA06P083100KJTA Vishay / Dale	RES ARRAY 4 RES 100K OHM 1206	2940
CSC08A0347R0GPA Vishay / Dale	RES ARRAY 4 RES 47 OHM 8SIP	0
MDP160312K0GE04 Vishay / Dale	RES ARRAY 8 RES 12K OHM 16DIP	0
CRA06S04312R0JTA Vishay / Dale	RES ARRAY 2 RES 12 OHM 0606	0
CRA04S08318K0JTD Vishay / Dale	RES ARRAY 4 RES 18K OHM 0804	2092
CSC06A03680RGPA Vishay / Dale	RES ARRAY 3 RES 680 OHM 6SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages