Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CRA04S0837K50JTD Vishay / Dale	RES ARRAY 4 RES 7.5K OHM 0804	20
CRA12E08315K0JTR Vishay / Dale	RES ARRAY 4 RES 15K OHM 2012	0
MDP160322K0GE04 Vishay / Dale	RES ARRAY 8 RES 22K OHM 16DIP	0
CRA04S0830000ZTD Vishay / Dale	RES ARRAY 4 RES ZERO OHM 0804	2
CSC06A0168R0GPA Vishay / Dale	RES ARRAY 5 RES 68 OHM 6SIP	0
CSC10A0133K0GPA Vishay / Dale	RES ARRAY 9 RES 33K OHM 10SIP	0
CSC06A01680RGPA Vishay / Dale	RES ARRAY 5 RES 680 OHM 6SIP	0
MDP160320K0GE04 Vishay / Dale	RES ARRAY 8 RES 20K OHM 16DIP	0
MSP10A0347K0FEJ Vishay / Dale	RES ARRAY 5 RES 47K OHM 10SIP	0
MSP08A0320K0GEJ Vishay / Dale	RES ARRAY 4 RES 20K OHM 8SIP	0
CRA06P08313K0JTA Vishay / Dale	RES ARRAY 4 RES 13K OHM 1206	0
MSP10A01220RGEJ Vishay / Dale	RES ARRAY 9 RES 220 OHM 10SIP	0
CSC08A03499KFPA Vishay / Dale	RES ARRAY 4 RES 499K OHM 8SIP	0
MSP08A03110KFEJ Vishay / Dale	RES ARRAY 4 RES 110K OHM 8SIP	0
CRA06S0835K60JTA Vishay / Dale	RES ARRAY 4 RES 5.6K OHM 1206	283
SOMC1405141AGEA Vishay / Dale	RES NTWRK 24 RES 270 OHM 14SOIC	0
MDP16012K20GE04 Vishay / Dale	RES ARRAY 15 RES 2.2K OHM 16DIP	0
MSP06A01470KGEJ Vishay / Dale	RES ARRAY 5 RES 470K OHM 6SIP	0
CSC04A03510RGPA Vishay / Dale	RES ARRAY 2 RES 510 OHM 4SIP	0
MDP1603220RGE04 Vishay / Dale	RES ARRAY 8 RES 220 OHM 16DIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages