Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CRA12E083680KJTR Vishay / Dale	RES ARRAY 4 RES 680K OHM 2012	0
CSC05A013K30GPA Vishay / Dale	RES ARRAY 4 RES 3.3K OHM 5SIP	0
CSC06A0322K0GEK Vishay / Dale	RES ARRAY 3 RES 22K OHM 6SIP	0
MSP06A0120K0GEJ Vishay / Dale	RES ARRAY 5 RES 20K OHM 6SIP	0
CSC08B05191AGPA Vishay / Dale	RES NETWORK 12 RES MULT OHM 8SIP	0
MDP16031K50GE04 Vishay / Dale	RES ARRAY 8 RES 1.5K OHM 16DIP	0
CSC10A0110K0FPA Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	0
CSC06A012K00GPA Vishay / Dale	RES ARRAY 5 RES 2K OHM 6SIP	0
CRA06P0832K40JTA Vishay / Dale	RES ARRAY 4 RES 2.4K OHM 1206	0
M8340108K1003FGD03 Vishay / Dale	RES ARRAY 4 RES 100K OHM 8SIP	0
CSC10B0110K0GPA Vishay / Dale	RES ARRAY 9 RES 10K OHM 10SIP	0
MDP1601270RGE04 Vishay / Dale	RES ARRAY 15 RES 270 OHM 16DIP	0
MSP06A03470KGEJ Vishay / Dale	RES ARRAY 3 RES 470K OHM 6SIP	0
SOMC16012K20GEA Vishay / Dale	RES ARRAY 15 RES 2.2K OHM 16SOIC	1824
CSC06A014K70GPA Vishay / Dale	RES ARRAY 5 RES 4.7K OHM 6SIP	0
CSC10A0112K0GPA Vishay / Dale	RES ARRAY 9 RES 12K OHM 10SIP	0
CSC08A05131AGPA Vishay / Dale	RES NETWORK 12 RES MULT OHM 8SIP	0
CSC08A031M00GPA Vishay / Dale	RES ARRAY 4 RES 1M OHM 8SIP	0
CSC10A03100KGPA Vishay / Dale	RES ARRAY 5 RES 100K OHM 10SIP	0
MSP10A015K10FEJ Vishay / Dale	RES ARRAY 9 RES 5.1K OHM 10SIP	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages