Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
CSC05A014K70GEK Vishay / Dale	RES ARRAY 4 RES 4.7K OHM 5SIP	2995
MSP10C011K50GEJ Vishay / Dale	RES ARRAY 9 RES 1.5K OHM 10SIP	0
MDP16012K00GE04 Vishay / Dale	RES ARRAY 15 RES 2K OHM 16DIP	0
MSP08A03100KGEJ Vishay / Dale	RES ARRAY 4 RES 100K OHM 8SIP	0
M8340102K1002GAD04 Vishay / Dale	RES ARRAY 8 RES 10K OHM 16DIP	21
CSC06A0310K0FPA Vishay / Dale	RES ARRAY 3 RES 10K OHM 6SIP	0
CRA06P0833K00JTA Vishay / Dale	RES ARRAY 4 RES 3K OHM 1206	0
MSP08A01100KGEJ Vishay / Dale	RES ARRAY 7 RES 100K OHM 8SIP	0
CRA06S04351R0JTA Vishay / Dale	RES ARRAY 2 RES 51 OHM 0606	0
SOMC16011K50GEA Vishay / Dale	RES ARRAY 15 RES 1.5K OHM 16SOIC	0
MDP1601100KGE04 Vishay / Dale	RES ARRAY 15 RES 100K OHM 16DIP	0
CSC08B031K00GPA Vishay / Dale	RES ARRAY 4 RES 1K OHM 8SIP	0
CRA06S04356R0JTA Vishay / Dale	RES ARRAY 2 RES 56 OHM 0606	0
CSC12B034K70GPA Vishay / Dale	RES ARRAY 6 RES 4.7K OHM 12SIP	0
M8340108K1002GGD03 Vishay / Dale	RES ARRAY 4 RES 10K OHM 8SIP	130
CSC08A013K30GPA Vishay / Dale	RES ARRAY 7 RES 3.3K OHM 8SIP	0
SOMC1601220RGEA Vishay / Dale	RES ARRAY 15 RES 220 OHM 16SOIC	0
MSP06C0110K0GEJ Vishay / Dale	RES ARRAY 5 RES 10K OHM 6SIP	0
MSP10A032K70FEJ Vishay / Dale	RES ARRAY 5 RES 2.7K OHM 10SIP	0
SOMC1603330RJEA Vishay / Dale	RES ARRAY 8 RES 330 OHM 16SOIC	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages